Samsung electronics co., ltd. (20240203855). SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
Organization Name
Inventor(s)
Un-Byoung Kang of Suwon-si (KR)
Sung Keun Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203855 titled 'SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
The semiconductor package described in the abstract includes a first redistribution layer substrate, a semiconductor chip, a coupling member, an encapsulant, and a second redistribution layer substrate.
- The coupling member, which is spaced apart from the semiconductor chip, consists of a vertical wire and a metal portion extending around the vertical wire.
- The first end of the coupling member is electrically connected to the first redistribution layer substrate, while the second end is connected to the second redistribution layer substrate.
Potential Applications:
- This technology can be used in various electronic devices such as smartphones, tablets, and computers.
- It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved:
- Provides a reliable and efficient way to connect semiconductor chips within a package.
- Ensures proper electrical connections between different components in the package.
Benefits:
- Enhances the overall performance and reliability of electronic devices.
- Facilitates miniaturization and integration of components in a compact space.
Commercial Applications:
- This technology can be valuable for semiconductor manufacturers, electronics companies, and other industries requiring advanced packaging solutions.
Questions about the technology: 1. How does the coupling member improve the electrical connections within the semiconductor package? 2. What are the advantages of using a vertical wire in the coupling member design?
Original Abstract Submitted
an embodiment provides a semiconductor package including: a first redistribution layer substrate; a semiconductor chip on the first redistribution layer substrate; a coupling member on the first redistribution layer substrate, wherein the coupling member is spaced apart from the semiconductor chip; an encapsulant on the first redistribution layer substrate, the semiconductor chip, and the coupling member; and a second redistribution layer substrate on the encapsulant, wherein the coupling member includes a vertical wire and a metal portion extending around the vertical wire, and wherein a first end of the coupling member is electrically connected to the first redistribution layer substrate, and a second end of the coupling member is electrically connected to the second redistribution layer substrate.
