Samsung electronics co., ltd. (20240203854). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeon Jeong Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203854 titled 'SEMICONDUCTOR PACKAGE
The abstract describes a semiconductor package with an interposer, a recess, a connection structure, posts, and semiconductor chips arranged in a specific configuration for electrical connections.
- Interposer with a recess and connection structure for organizing electrical connections
- Posts on the interposer and connection structure for facilitating connections between semiconductor chips
- Lower semiconductor chip connected to the posts through the connection structure
- Upper semiconductor chip placed on top of the lower semiconductor chip for further electrical connections
Potential Applications: - Advanced semiconductor packaging technology for high-performance electronic devices - Improved signal transmission and power efficiency in integrated circuits
Problems Solved: - Enhances electrical connectivity and signal integrity in semiconductor packages - Enables compact and efficient design of electronic devices
Benefits: - Increased performance and reliability of electronic devices - Enhanced thermal management and power distribution capabilities
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronics Description: This technology can be utilized in various industries such as telecommunications, automotive, and consumer electronics for developing cutting-edge electronic devices with improved functionality and performance.
Questions about the technology: 1. How does this semiconductor packaging technology improve signal transmission efficiency? - The technology optimizes the electrical connections between semiconductor chips, reducing signal loss and improving overall performance.
2. What are the key advantages of using an interposer in semiconductor packaging? - The interposer provides a platform for organizing complex electrical connections in a compact and efficient manner, enhancing the overall functionality of the semiconductor package.
Original Abstract Submitted
a semiconductor package an interposer disposed on a substrate, a recess recessed from an upper surface of the interposer, a connection structure disposed inside the recess, a first post disposed on the upper surface of the interposer and electrically connected to the interposer, a second post disposed on an upper surface of the connection structure and electrically connected to the connection structure, a first lower semiconductor chip disposed between the first and second posts and disposed on the upper surface of the interposer and the upper surface of the connection structure. the first lower semiconductor chip is electrically connected to the second post through the connection structure, and a first upper semiconductor chip is disposed on an upper surface of the first lower semiconductor chip. the first upper semiconductor chip is electrically connected to the first lower semiconductor chip through the second post and the connection structure.
