Samsung electronics co., ltd. (20240203825). SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE simplified abstract
Contents
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
Organization Name
Inventor(s)
Sungchan Kang of Suwon-si (KR)
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203825 titled 'SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
The semiconductor device described in the abstract includes a semiconductor chip with an integrated circuit, a cooling channel to provide coolant for cooling the chip, and flexible capillary patterns inside the cooling channel to move the coolant by capillary action.
- The semiconductor device features flexible capillary patterns that can move coolant through capillary action.
- Each capillary pattern has a first portion supported by the chip's surface and a second portion that changes curvature based on temperature.
- The cooling channel helps dissipate heat from the semiconductor chip, enhancing its performance and longevity.
- The innovative design of the capillary patterns allows for efficient cooling of the semiconductor chip, improving overall device reliability.
- By utilizing capillary action, the device can effectively manage heat dissipation, ensuring optimal performance under varying temperature conditions.
Potential Applications: - This technology can be applied in high-performance computing systems where efficient cooling is crucial. - It can also be used in automotive electronics to enhance the reliability of semiconductor components in vehicles. - The semiconductor device could find applications in aerospace systems where temperature management is critical for operation.
Problems Solved: - Efficient cooling of semiconductor chips to prevent overheating and ensure optimal performance. - Enhanced reliability and longevity of semiconductor devices through effective heat dissipation. - Improved thermal management in electronic systems to maintain stable operation under varying temperature conditions.
Benefits: - Increased performance and reliability of semiconductor devices. - Enhanced thermal management capabilities for improved overall system efficiency. - Extended lifespan of electronic components through effective heat dissipation.
Commercial Applications: Title: Advanced Thermal Management Solutions for Semiconductor Devices This technology can be commercialized in the electronics industry for various applications, including data centers, automotive electronics, and aerospace systems. By offering superior thermal management capabilities, the semiconductor device can cater to the growing demand for high-performance and reliable electronic systems in these sectors.
Questions about Semiconductor Device Cooling Technology: 1. How does the capillary action in the flexible patterns help in cooling the semiconductor chip? 2. What are the potential long-term benefits of using this innovative cooling technology in electronic devices?
Original Abstract Submitted
a semiconductor device includes a semiconductor chip including a semiconductor integrated circuit; a cooling channel including a surface of the semiconductor chip and configured to provide a passage for a coolant to cool the semiconductor chip; and a plurality of flexible capillary patterns on the surface of the semiconductor chip inside the cooling channel and configured to move the coolant by capillary action, wherein each capillary pattern of the plurality of flexible capillary patterns may include a first portion in a length direction of the capillary pattern that contacts and is supported by the surface of the semiconductor chip, and a second portion in the length direction that is spaced apart from and unsupported by the surface of the semiconductor chip, and a curvature of the second portion of each capillary pattern of the plurality of flexible capillary patterns changes according to temperature.
