Samsung electronics co., ltd. (20240203821). SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE simplified abstract
Contents
SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE
Organization Name
Inventor(s)
Sungchan Kang of Suwon-si (KR)
SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203821 titled 'SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE
The semiconductor device described in the patent application includes a semiconductor chip with a cooling channel that contains a liquid coolant. The cooling channel has a fine pattern on the wall surface to create a capillary force that drives the flow of the liquid coolant. The channel is divided into a liquid channel area and a gas channel area, each serving a specific purpose in the cooling process.
- The semiconductor device features a cooling channel with a fine pattern on the wall surface to generate a capillary force for liquid coolant flow.
- The cooling channel is divided into a liquid channel area and a gas channel area to optimize the cooling process.
- The liquid channel area is designed to pass the liquid coolant, while the gas channel area is intended for gaseous coolant flow.
- The innovative design enhances the efficiency of cooling the semiconductor chip, improving overall performance and reliability.
Potential Applications: - High-performance computing systems - Data centers - Automotive electronics - Aerospace technology
Problems Solved: - Overheating of semiconductor chips - Inefficient cooling systems - Reliability issues due to heat buildup
Benefits: - Improved cooling efficiency - Enhanced performance of semiconductor devices - Increased reliability and longevity of electronic components
Commercial Applications: Title: Advanced Semiconductor Cooling Technology for High-Performance Applications This technology can be utilized in various commercial applications such as high-performance computing systems, data centers, automotive electronics, and aerospace technology. The enhanced cooling efficiency and improved performance of semiconductor devices make this technology valuable for industries requiring reliable and efficient electronic components.
Questions about Semiconductor Cooling Technology: 1. How does the fine pattern on the wall surface of the cooling channel improve the flow of the liquid coolant? The fine pattern generates a capillary force that drives the flow of the liquid coolant, enhancing cooling efficiency.
2. What are the specific benefits of dividing the cooling channel into liquid and gas channel areas? The division allows for optimized cooling processes, with the liquid channel area passing the liquid coolant and the gas channel area facilitating the flow of gaseous coolant.
Original Abstract Submitted
a semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel including at least a first portion that is inside the semiconductor chip, a wall surface including a fine pattern configured to generate a capillary force that causes a liquid coolant to flow in the cooling channel, a liquid channel area in a first area of the cooling channel where the fine pattern is formed and configured to pass the liquid coolant, and a gas channel area in a second area of the cooling channel where the fine pattern is not formed and configured to pass a gaseous coolant.
