18208748. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
PRINTED CIRCUIT BOARD
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18208748 titled 'PRINTED CIRCUIT BOARD
The abstract of the patent application describes a printed circuit board with specific features and innovations:
- The circuit board includes a first insulating layer.
- It has a connection via that penetrates through the insulating layer, with an exposed upper surface.
- A cavity also penetrates through the insulating layer, with the upper surface of the insulating layer forming the bottom surface of the cavity.
- A bridge is placed in the cavity, with a first bridge pad on the lower side of the bridge.
- A bonding layer with conductive particles is connected to the connection via and the first bridge pad.
Potential Applications: - This technology could be used in electronic devices such as smartphones, computers, and IoT devices. - It may find applications in automotive electronics, aerospace systems, and medical devices.
Problems Solved: - Provides a reliable and efficient way to create connections in printed circuit boards. - Helps in reducing the size and weight of electronic devices by optimizing the circuit board design.
Benefits: - Improved reliability and durability of connections. - Enhanced performance of electronic devices. - Cost-effective manufacturing process for circuit boards.
Commercial Applications: Title: "Advanced Printed Circuit Boards for Enhanced Electronic Devices" This technology can be commercially used in the manufacturing of consumer electronics, industrial equipment, and communication devices. It can lead to more compact and efficient electronic products, giving companies a competitive edge in the market.
Prior Art: Readers can explore prior patents related to printed circuit board design, connection technologies, and bonding layers to understand the evolution of this technology.
Frequently Updated Research: Stay updated on the latest advancements in printed circuit board technology, materials science, and electronics manufacturing processes to leverage the full potential of this innovation.
Questions about Printed Circuit Boards: 1. How does this technology improve the reliability of connections in electronic devices? 2. What are the key advantages of using a bonding layer with conductive particles in circuit board design?
Original Abstract Submitted
A printed circuit board includes a first insulating layer; a connection via penetrating through at least a portion of the first insulating layer and having an upper surface exposed to an upper surface of the first insulating layer; a cavity penetrating through at least a portion of the first insulating layer and having the upper surface of the first insulating layer as a bottom surface of the cavity; a bridge disposed in the cavity and having a first bridge pad disposed on a lower side of the bridge; and a bonding layer including conductive particles connected to the connection via and the first bridge pad.
