18138893. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
PRINTED CIRCUIT BOARD
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Jong Eun Park of Suwon-si (KR)
PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18138893 titled 'PRINTED CIRCUIT BOARD
The abstract describes a printed circuit board with multiple metal layers and seed metal layers, designed to fill via holes and improve conductivity.
- The circuit board includes a first metal layer, an organic insulating layer, a first seed metal layer, a second seed metal layer, and a second metal layer.
- The first seed metal layer contains titanium (Ti) and the second seed metal layer is an electroless plating layer.
- The second seed metal layer extends onto the wall surface of the via hole and the exposed upper surface of the first metal layer.
- The second metal layer fills at least a portion of the via hole, enhancing the conductivity of the circuit board.
Potential Applications:
- This technology can be used in electronic devices, telecommunications equipment, and industrial machinery where high-performance circuit boards are required.
Problems Solved:
- This innovation addresses the need for improved conductivity and reliability in printed circuit boards.
Benefits:
- Enhanced conductivity and reliability in circuit boards lead to better performance and longevity of electronic devices.
Commercial Applications:
- This technology can be applied in the manufacturing of consumer electronics, automotive electronics, and aerospace systems, improving the overall efficiency and durability of these products.
Questions about the technology: 1. How does the use of seed metal layers improve the conductivity of the printed circuit board? 2. What are the specific advantages of using an electroless plating layer in the second seed metal layer?
Original Abstract Submitted
A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.
