18132195. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Byung Woo Kang of Suwon-si (KR)
Sang Wook Lee of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18132195 titled 'MULTILAYER ELECTRONIC COMPONENT
The multilayer electronic component described in the patent application consists of a body with a dielectric layer and internal electrodes, as well as external electrodes connected to the internal electrodes. One of the external electrodes includes a conductive resin layer with specific properties.
- The multilayer electronic component includes a body with a dielectric layer and internal electrodes.
- External electrodes are connected to the internal electrodes and are made of a conductive resin layer with specific characteristics.
- The conductive resin layer contains conductive particles, including metal particles and intermetallic compounds.
- The ratio of particles with a Feret diameter of 14 μm or more to the total number of particles is at least 17%.
Potential Applications: - This technology can be used in various electronic devices requiring multilayer components. - It can be applied in circuit boards, sensors, and other electronic systems.
Problems Solved: - Provides improved conductivity and reliability in electronic components. - Enhances the performance and durability of multilayer electronic devices.
Benefits: - Increased efficiency and functionality of electronic devices. - Enhanced electrical connectivity and stability. - Improved overall performance and longevity of electronic systems.
Commercial Applications: Title: Enhanced Multilayer Electronic Components for Improved Performance in Electronic Devices This technology can be utilized in the manufacturing of various electronic devices, including smartphones, tablets, computers, and automotive electronics. The improved conductivity and reliability offered by these components can lead to enhanced product performance and customer satisfaction in the electronics market.
Prior Art: Further research can be conducted in the field of multilayer electronic components and conductive resin materials to explore existing technologies and innovations in this area.
Frequently Updated Research: Stay updated on advancements in conductive resin materials and multilayer electronic components to ensure the latest technologies and techniques are being utilized in electronic device manufacturing.
Questions about Multilayer Electronic Components: 1. How does the ratio of particles with a Feret diameter of 14 μm or more impact the performance of the conductive resin layer in electronic components? 2. What are the specific applications of this technology in the automotive industry?
Original Abstract Submitted
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 μm or more, among the first conductive particles, and N2 is a total number of first conductive particles.
