18386090. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18386090 titled 'MULTILAYER ELECTRONIC COMPONENT
Simplified Explanation:
The patent application describes a protective layer with glass that can be placed between a first electrode layer and an internal electrode to prevent external moisture, plating solution, and hydrogen from penetrating, thereby enhancing the moisture resistance reliability of a multilayer electronic component.
Key Features and Innovation:
- Protective layer with glass blocks penetration of external moisture, plating solution, and hydrogen.
- Improves moisture resistance reliability of multilayer electronic components.
Potential Applications: This technology can be applied in various electronic devices where moisture resistance is crucial, such as sensors, actuators, and communication devices.
Problems Solved: This technology addresses the issue of external moisture, plating solution, and hydrogen penetrating electronic components, which can lead to malfunctions and reduced reliability.
Benefits:
- Enhanced moisture resistance reliability.
- Improved longevity of electronic components.
- Reduced risk of malfunctions due to external factors.
Commercial Applications: The technology can be utilized in the manufacturing of electronic devices for industries such as automotive, aerospace, and consumer electronics, where moisture resistance is essential for product performance and durability.
Prior Art: Readers can explore prior patents related to moisture-resistant electronic components and protective layers to gain a deeper understanding of the existing technology in this field.
Frequently Updated Research: Stay updated on the latest advancements in protective layers for electronic components to ensure the most effective and reliable moisture resistance solutions are implemented.
Questions about Moisture-Resistant Electronic Components: 1. How does the protective layer with glass improve the moisture resistance reliability of electronic components? 2. What are the potential drawbacks or limitations of using glass in the protective layer for electronic components?
Original Abstract Submitted
A protective layer including glass may be disposed between an end of a first electrode layer in contact with one end of an internal electrode and a body thereby blocking a penetration path of external moisture, a plating solution, and hydrogen to improve the moisture resistance reliability of a multilayer electronic component.
