18383174. COIL COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
COIL COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
In Young Kang of Suwon-si (KR)
Boum Seock Kim of Suwon-si (KR)
COIL COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18383174 titled 'COIL COMPONENT
The abstract describes a coil component with a body, a support member, and two coils with lead-out portions and connection portions connected by vias.
- The coil component consists of a body and a support member.
- It includes a first coil with a lead-out portion and a connection portion on one surface, connected to a sub-lead-out portion on the other surface via a via.
- A second coil is also present on the other surface, with a lead-out portion and a connection portion connected to the first coil via a second via.
- The first via has a larger diameter than the second via.
Potential Applications: - This technology can be used in various electronic devices requiring coil components. - It can be applied in the manufacturing of sensors, antennas, and other electronic circuits.
Problems Solved: - Provides a compact and efficient design for coil components. - Ensures reliable connections between different coil portions.
Benefits: - Improved performance and reliability of electronic devices. - Space-saving design for compact electronic products.
Commercial Applications: Title: Innovative Coil Component Technology for Enhanced Electronic Devices This technology can be utilized in the production of smartphones, IoT devices, and medical equipment, enhancing their performance and reliability in a compact form factor.
Prior Art: Readers can explore prior patents related to coil components, vias, and electronic circuit design to understand the evolution of this technology.
Frequently Updated Research: Stay updated on advancements in coil component design, electronic circuitry, and miniaturization techniques to enhance the efficiency and applications of this technology.
Questions about Coil Component Technology: 1. How does the diameter of the vias impact the performance of the coil component? 2. What are the key considerations in designing coil components for different electronic applications?
Original Abstract Submitted
A coil component includes a body, a support member, a first coil including a first coil portion disposed on one surface of the support member and having one end and the other end being a first lead-out portion and a first connection portion, respectively, a sub-lead-out portion disposed on the other surface of the support member, and a first via connecting the first lead-out portion and the sub-lead-out portion, a second coil disposed on the other surface of the support member and including a second coil portion having one end and the other end being a second lead-out portion and a second connection portion, respectively, and a second via connecting the first and second connection portions, wherein the first via has a diameter greater than a diameter of the second via.
