18582407. INTERCONNECT SINGULATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

INTERCONNECT SINGULATION

Organization Name

TEXAS INSTRUMENTS INCORPORATED

Inventor(s)

Chih-Chien Ho of New Taipei City (TW)

INTERCONNECT SINGULATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18582407 titled 'INTERCONNECT SINGULATION

Simplified Explanation: The patent application describes a method for aligning interconnects by forming a frame of strips of interconnects, aligning them, and then singulating them.

• **Key Features and Innovation:**

   - Trimming and forming a frame of strips of interconnects
   - Interdigitated pins in the frame
   - Removing siderails to create an array of strips of interconnects
   - Aligning sets of strips to create an aligned array
   - Singulating the aligned array of strips of interconnects

• **Potential Applications:**

   - Electronics manufacturing
   - Semiconductor industry
   - PCB assembly

• **Problems Solved:**

   - Ensuring precise alignment of interconnects
   - Improving efficiency in interconnect assembly
   - Enhancing the reliability of electronic devices

• **Benefits:**

   - Increased accuracy in interconnect alignment
   - Streamlined interconnect assembly process
   - Higher quality and reliability of electronic products

• **Commercial Applications:**

   - "Innovative Method for Interconnect Alignment in Electronics Manufacturing"
   - This technology can be utilized in the production of various electronic devices, improving their performance and reliability.

• **Prior Art:**

   - Further research can be done in the field of interconnect alignment methods in electronics manufacturing to explore existing technologies and innovations.

• **Frequently Updated Research:**

   - Stay updated on advancements in interconnect alignment technologies in the electronics industry to enhance manufacturing processes and product quality.

Questions about Interconnect Alignment: 1. What are the potential challenges in implementing this method in large-scale electronics manufacturing? 2. How does this method compare to traditional interconnect alignment techniques in terms of efficiency and accuracy?

Original Abstract Submitted

A method for aligning interconnects that includes trimming and forming a frame of strips of interconnects. The frame of strips of interconnects includes interdigitated pins. The method also includes removing siderails from the frame of strips of interconnects to provide an array of strips of interconnects. The method includes aligning a first set of strips of interconnects in the array of strips of interconnects such that pins of the first set of strips of interconnects are aligned with pins of a second set of strips of interconnects in the array of strips of interconnects. A strip of interconnects of the first set of strips of interconnects are adjacent to a strip of interconnects of the second set of strips of interconnects to provide an aligned array of strips of interconnects. The method further includes singulating the aligned array of strips of interconnects.