18349024. SEMICONDUCTOR PACKAGE simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Inventor(s)
Bong Hyuk Park of Daejeon (KR)
SEUNG HUN Wang of Daejeon (KR)
Seunghyun Jang of Daejeon (KR)
SEOK BONG Hyun of Daejeon (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18349024 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a semiconductor chip with an integrated circuit (IC) pad that outputs a wireless frequency signal, a lead frame with a package pad to receive the signal, and wires connecting the IC pad to the package pad with a circuit element in parallel or series.
- The semiconductor package features a semiconductor chip with an IC pad for wireless frequency signal output.
- It includes a lead frame with a package pad to receive the wireless frequency signal.
- Wires connect the IC pad to the package pad, with a circuit element in parallel or series.
- The RF output impedance of the package pad or IC pad is controlled by the circuit element or connection relationship.
Potential Applications: - Wireless communication devices - IoT devices - RF transmitters
Problems Solved: - Controlling RF output impedance in semiconductor packages - Improving wireless signal transmission efficiency
Benefits: - Enhanced wireless communication performance - Better signal quality - Increased reliability in RF transmissions
Commercial Applications: Title: "Enhancing Wireless Communication with Semiconductor Packages" This technology can be used in various wireless communication devices, IoT applications, and RF transmitters, improving signal quality and transmission efficiency.
Questions about the technology: 1. How does the circuit element control the RF output impedance in the semiconductor package? 2. What are the specific advantages of using this technology in IoT devices?
Original Abstract Submitted
A semiconductor package is provided. The semiconductor package includes a semiconductor chip including an integrated circuit (IC) pad configured to output a wireless frequency signal, a lead frame including a package pad configured to receive the wireless frequency signal, a first wire of which one end is connected to the IC pad, a second wire of which one end is connected to the package pad, and a circuit element connected to the first wire and the second wire in parallel or in series. A radio frequency (RF) output impedance of the package pad or an RF output impedance of the IC pad is controlled by a type of the circuit element or a connection relationship between the circuit element, the first wire, and the second wire.
