18076733. HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES simplified abstract (International Business Machines Corporation)

HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES

Organization Name

International Business Machines Corporation

Inventor(s)

Barnim Alexander Janta-polczynski of Shefford (CA)

HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18076733 titled 'HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES

The patent application describes a package structure that includes electronic and photonic components, bridge interconnect devices, and optical waveguide devices.

• The package structure integrates electronic and photonic devices, enabling efficient communication between them.
• Bridge interconnect devices facilitate electrical connections between electronic and photonic components.
• Optical waveguide devices create an optical bus for routing optical signals within the package structure.
• Photonic devices serve as electro-optical interfaces between electronic devices and the optical bus.

Potential Applications

This technology can be applied in telecommunications, data centers, and high-speed computing systems where efficient communication between electronic and photonic components is crucial.

Problems Solved

The package structure addresses the challenge of integrating electronic and photonic devices in a compact and efficient manner, enabling seamless communication between them.

Benefits

The benefits of this technology include improved data transfer speeds, reduced energy consumption, and enhanced overall system performance by leveraging the advantages of both electronic and photonic components.

Commercial Applications

This technology has commercial applications in the telecommunications industry, data center infrastructure, and high-performance computing systems, where high-speed data transfer and efficient communication are essential for optimal performance.

Prior Art

Readers interested in exploring prior art related to this technology can start by researching integrated photonics packaging, electro-optical interfaces, and optical waveguide technologies.

Frequently Updated Research

Researchers are continuously exploring advancements in integrated photonics packaging, bridge interconnect devices, and optical waveguide technologies to further enhance the performance and efficiency of heterogeneous package structures.

Questions about Heterogeneous Package Structures

What are the key components of a heterogeneous package structure?

A heterogeneous package structure typically comprises electronic devices, photonic devices, bridge interconnect devices, and optical waveguide devices to enable seamless communication between electronic and photonic components.

How does the optical waveguide device contribute to the functionality of the package structure?

The optical waveguide device in the package structure serves as an optical bus for routing optical signals between photonic devices, enabling efficient communication and data transfer within the system.

Original Abstract Submitted

Heterogeneous package structures comprising photonic components are provided. For example, an exemplary package structure comprises at least one electronic device, at least one photonic device, at least one bridge interconnect device, and at least one optical waveguide device. The at least one bridge interconnect device is configured to electrically connect the at least one electronic device to the at least one photonic device. The at least one optical waveguide device is optically coupled to the at least one photonic device to implement an optical bus for routing optical signals in the package structure. The at least one photonic device is configured to implement an electro-optical interface between the at least one electronic device and the optical bus.