Patent Applications by Applied Materials Inc on 14th August 2025

Applied Materials Inc: 32 patent applications

Applied Materials Inc has applied for patents in the areas of H01L21/68742 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks, 3), H01L21/68757 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks, 3), B24B37/013 (Devices or means for detecting lapping completion, 2), B24B49/105 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth, 2), H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions, 2)

Patent Applications by Applied Materials Inc

20250255831. VAPOR PHASE COATING TECHNOLOGY FOR PHARMACEUTICAL ABUSE DETERRENT FORMULATIONS

Abstract: A method of preparing an abuse deterrent pharmaceutical composition having a drug-containing core enclosed by one or more metal oxide materials is provided. The method includes the sequential steps of (a) loading the particles comprising the drug into a reactor, (b) applying a vaporous or gaseous me...

20250256371. ENDPOINT CONTROL FOR INCONSISTENT UNDERLAYER

Abstract: A substrate is monitored during polishing with an in-situ monitoring system so as to generate a sequence of signal values. The sequence of signal values from the zone is converted into a sequence of effective thickness values for the zone with each effective thickness value including contributions o...

20250256372. MULTI-ZONE PROFILE CONTROL FOR INCONSISTENT UNDERLAYER

Abstract: A substrate is monitored during polishing with an in-situ monitoring system so as to generate a sequence of signal values. The sequence of signal values from the zone is converted into a sequence of effective thickness values for each of multiple zones. For each zone, a function is fit to the sequen...

20250256373. Generation of Starting Thickness Profile Using In-SITU Monitoring System

Abstract: A method of determining a starting thickness profile for a conductive layer on a substrate includes monitoring a calibration substrate during polishing to generate a sequence of first traces, detecting exposure of an underlying layer, and continuing to monitor the calibration substrate after exposur...

20250257451. HIGH DENSITY AMORPHOUS CARBON FILM WITH REDUCED HYDROGEN CONTENT

Abstract: Embodiments described herein generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of amorphous carbon films on a substrate with improved etch selectivity. In certain embodiments, a method of forming an a...

20250257454. SIDE BLOCKS FOR GAS ACTIVATION, AND RELATED PROCESSING CHAMBERS, PROCESS KITS, AND METHODS

Abstract: Embodiments of the present invention relate to blocks for gas activation, related substrate processing chambers, process kits, and methods. In some embodiments, a processing chamber applicable for use in semiconductor manufacturing includes a chamber body at least partially defining an internal volu...

20250258096. PHASE MASKING FOR POLARIZATION AND OPTICAL SIGNAL CONTROL IN OPTICAL INSPECTION SYSTEMS

Abstract: Implementations disclosed describe, among other things, a sample inspection system that includes an illumination subsystem to generate a light incident on a sample. The sample inspection system includes a collection subsystem having optical elements to collect a light generated upon interaction of t...

20250258325. GRADIENT ENCAPSULATION OF WAVEGUIDE GRATINGS

Abstract: Embodiments described herein relate to gradient encapsulation of waveguide outcoupler gratings for control of diffraction efficiency and directionality. A device includes a first grating formed over a substrate, the first grating having a plurality of first structures extending away from the substra...

20250258401. FLEXIBLE MULTI-LAYERED COVER LENS STACKS FOR FOLDABLE DISPLAYS

Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an adhesion promotion layer on the glass layer, an anti-ref...

20250258433. UNDERLAYER TREATMENT FOR IMPROVED PHOTORESIST ADHESION

Abstract: The present disclosure generally relates to the fabrication of integrated circuits. More particularly, embodiments described herein provide techniques for forming resist underlayers having reduced sp2 hybridized carbon content for improving EUV lithography performance. In one embodiment, a method of...

20250258434. DEPOSITION OF RESIST UNDERLAYER WITH REDUCED SP2 CARBON CONTENT

Abstract: The present disclosure generally relates to the fabrication of integrated circuits. More particularly, embodiments described herein provide techniques for forming resist underlayers having reduced sp2 hybridized carbon content for improving EUV lithography performance. In one embodiment, a method of...

20250258488. TIME CONSTRAINT MANAGEMENT AT A MANUFACTURING SYSTEM

Abstract: A method for time constraint management at a manufacturing system is provided. A first request to initiate a set of operations to be run for a queue of substrates at a manufacturing system is received. A first plurality of candidate substrates to be processed during the set of operations is identifi...

20250259815. THERMOELECTRIC CONTROL FOR A CRUCIBLE FOR USE WITH AN ION SOURCE

Abstract: A vaporizer that may be used to introduce vapor from a dopant material into the arc chamber is disclosed. The vaporizer includes a crucible and a thermoelectric device disposed on a surface of the crucible near the outlet. The thermoelectric device may be controlled to heat the dopant material to cr...

20250259823. BROADBAND MICROWAVE RESONANT ANTENNA

Abstract: Embodiments disclosed herein include dielectric resonators for microwave plasma application. In an embodiment, such an apparatus comprises a dielectric puck, where the dielectric puck has a cylindrical shape. In an embodiment, the dielectric puck comprises a first region with a first dielectric cons...

20250259829. COMPONENT, SYSTEM, AND METHOD FOR IMPROVED FORELINE CLEANING

Abstract: A component, system, and method for improved foreline cleaning of semiconductor chambers and components are disclosed herein. In one example, a processing chamber component includes a foreline constructed from stainless steel having a circular cross sectional shape and an inner surface. The foreline...