18404934. METHOD AND APPARATUS FOR DIRECT WRITING PHOTOETCHING BY PARALLEL INTERPENETRATING SUPER-RESOLUTION HIGH-SPEED LASER simplified abstract (ZHEJIANG UNIVERSITY)
Contents
- 1 METHOD AND APPARATUS FOR DIRECT WRITING PHOTOETCHING BY PARALLEL INTERPENETRATING SUPER-RESOLUTION HIGH-SPEED LASER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD AND APPARATUS FOR DIRECT WRITING PHOTOETCHING BY PARALLEL INTERPENETRATING SUPER-RESOLUTION HIGH-SPEED LASER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD AND APPARATUS FOR DIRECT WRITING PHOTOETCHING BY PARALLEL INTERPENETRATING SUPER-RESOLUTION HIGH-SPEED LASER
Organization Name
Inventor(s)
Cuifang Kuang of Hangzhou (CN)
Hongqing Wang of Hangzhou (CN)
METHOD AND APPARATUS FOR DIRECT WRITING PHOTOETCHING BY PARALLEL INTERPENETRATING SUPER-RESOLUTION HIGH-SPEED LASER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18404934 titled 'METHOD AND APPARATUS FOR DIRECT WRITING PHOTOETCHING BY PARALLEL INTERPENETRATING SUPER-RESOLUTION HIGH-SPEED LASER
Simplified Explanation
The method and apparatus described in the patent application involve direct writing photoetching using a parallel interpenetrating super-resolution high-speed laser. The process includes generating multi-beam solid and hollow light spots, combining them to create a modulated multi-beam light spot, outputting a writing waveform, and moving a displacement stage to complete the writing of patterns.
- Multi-beam solid and hollow light spots are generated for writing and inhibition, respectively.
- These spots are combined to create a modulated multi-beam light spot.
- A writing waveform is output based on a multichannel acousto-optic modulator.
- The displacement stage moves at a constant speed to complete the writing of patterns.
Potential Applications
This technology could be applied in industries such as microelectronics, semiconductor manufacturing, and nanotechnology for high-precision direct writing and photoetching processes.
Problems Solved
This innovation solves the problem of achieving super-resolution high-speed laser writing with precision and efficiency, allowing for intricate patterns to be created with accuracy.
Benefits
The benefits of this technology include increased speed and accuracy in direct writing and photoetching processes, leading to improved productivity and quality in manufacturing.
Potential Commercial Applications
Potential commercial applications of this technology include advanced microfabrication, integrated circuit manufacturing, and high-resolution printing industries.
Possible Prior Art
One possible prior art in this field could be the use of traditional laser writing techniques for direct writing and photoetching processes. However, the parallel interpenetrating super-resolution approach described in the patent application offers a more efficient and precise method.
Unanswered Questions
How does this technology compare to existing laser writing methods in terms of speed and precision?
The patent application provides details on the process and components involved in the direct writing photoetching method. However, a comparison with traditional laser writing methods in terms of speed and precision could provide a better understanding of the advantages of this innovation.
What are the potential limitations or challenges in implementing this technology on a larger scale for industrial applications?
While the patent application outlines the process for direct writing photoetching using a parallel interpenetrating super-resolution high-speed laser, it does not address the potential limitations or challenges that may arise when scaling up this technology for industrial applications. Understanding these factors could help in assessing the feasibility of widespread adoption.
Original Abstract Submitted
A method and an apparatus for direct writing photoetching by parallel interpenetrating super-resolution high-speed laser. The method of the present application uses a parallel interpenetrating algorithm. Firstly, a multi-beam solid light spot for writing is generated based on a writing light spatial light modulator; a multi-beam hollow light spot for inhibition is generated based on an inhibition optical spatial light modulator; the multi-beam solid light spot is combined with the multi-beam hollow light spot to generate a modulated multi-beam light spot; a writing waveform is output based on a multichannel acousto-optic modulator, a displacement stage moves at a constant speed until writing of a whole column of areas is completed, an optical switch is turned off, and the displacement stage conducts one-time stepping movement; the process is not stopped until all patterns are written.
