Semiconductor Device and Method of Forming Selective Shielding Using UV Curable Ink

Abstract: a semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. an antenna can be formed within the substrate. an encapsulant is deposited over the surface of the substrate. an ink material is deposited over the surface of the substrate. the ink material can be a curable epoxy. the ink material is formed as a straight wall, curved wall, stepped wall, stepped convex wall, and such. the ink material can be stacked with a first ink material deposited on the surface of the substrate and a second ink material deposited over the first ink material. a shielding material is disposed over the encapsulant with the ink material blocking progression of the shielding material. an electrical connector is disposed over the surface of the substrate outside the ink material to avoid contact with the shielding material.

Inventor(s): JinHee Jung, ChangOh Kim, WooSoon Kim

CPC Classification: H01L23/66 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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