RELEASE COMPOSITION

Abstract: the present application provides a release composition, a release layer, a release film, and a pressure-sensitive adhesive film. the release composition of the present application has excellent curability, and thus can be stably cured to form a release layer. when the release layer has been formed, the present application can provide a release composition allowing to exhibit a stable residual adhesion rate even if the release layer is repeatedly applied to a pressure-sensitive adhesive layer or the like. the release layer of the present application can maintain desired release characteristics even if it is maintained at room temperature and a high temperature for a long time. in addition, the release layer can stably maintain a balance of high-speed and low-speed peeling forces.

Inventor(s): Jun Hyoung PARK, Hyun Cheol KIM

CPC Classification: C09J7/401 (ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine ))

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