18360128. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR MEMORY DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Minji Park of Suwon-si (KR)

Dongha Shin of Suwon-si (KR)

Hongsoo Jeon of Suwon-si (KR)

SEMICONDUCTOR MEMORY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18360128 titled 'SEMICONDUCTOR MEMORY DEVICE

Simplified Explanation

The semiconductor memory device described in the patent application includes a peripheral region with high voltage transistors, lower lines, and a cell region. The lower lines are divided into high voltage and low voltage lines, which are connected in a specific layout to optimize performance.

  • The semiconductor memory device comprises a peripheral region with high voltage transistors on the substrate.
  • Lower lines are connected to the high voltage transistors, with first and second lower lines extending along a specific direction.
  • The first lower lines include high voltage and low voltage lines, while the second lower lines include high voltage and low voltage lines.
  • The layout of the lower lines is designed to improve the efficiency and performance of the memory device.

Potential Applications

This technology could be applied in:

  • High-performance computing systems
  • Data centers
  • Automotive electronics

Problems Solved

This technology helps address:

  • Efficient data storage and retrieval
  • High voltage requirements in memory devices
  • Optimization of memory device layout for improved performance

Benefits

The benefits of this technology include:

  • Enhanced memory device performance
  • Improved efficiency in data processing
  • Higher reliability in high voltage applications

Potential Commercial Applications

This technology could be commercially applied in:

  • Memory chip manufacturing
  • Semiconductor industry
  • Electronics manufacturing

Possible Prior Art

One possible prior art in this field is the use of optimized layouts for memory devices to improve performance and efficiency.

Unanswered Questions

How does this technology compare to existing memory device layouts in terms of performance and efficiency?

The article does not provide a direct comparison with existing memory device layouts to evaluate the advantages of this technology.

What specific challenges were faced during the development and implementation of this technology?

The article does not detail the specific challenges encountered during the development and implementation of this technology.


Original Abstract Submitted

Disclosed are semiconductor memory devices comprising a peripheral region including a substrate, high voltage transistors on the substrate, first lower lines connected to the high voltage transistors, and second lower lines connected to the first lower lines, and a cell region on the peripheral region. The first and the second lower lines extend along a first direction parallel to an upper surface of the substrate. The first lower lines include first high voltage lines and first low voltage lines. The second lower lines include second high voltage lines and second low voltage lines. The second high voltage lines and the first low voltage lines separated in a second direction parallel to the upper surface of the substrate and a third direction perpendicular to the upper surface of the substrate, and the second low voltage lines and the first high voltage lines separated in the second direction and the third direction.