18357484. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
KYUNG DON Mun of Suwon-si (KR)
KYOUNG LIM Suk of Suwon-si (KR)
HYEONJEONG Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18357484 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a lower circuit part with a connection structure and a logic chip in separate regions, a memory structure overlapping the connection structure vertically, and a thermal radiation structure overlapping the logic chip vertically. The logic chip and memory structure are horizontally spaced apart.
- Connection structure and logic chip in separate regions
- Memory structure overlaps connection structure vertically
- Thermal radiation structure overlaps logic chip vertically
- Logic chip and memory structure are horizontally spaced apart
Potential Applications
The technology described in this semiconductor package could be applied in:
- Consumer electronics
- Automotive systems
- Industrial machinery
Problems Solved
This innovation helps in:
- Improving thermal management
- Enhancing memory performance
- Optimizing circuit layout
Benefits
The benefits of this technology include:
- Increased efficiency
- Better heat dissipation
- Enhanced overall performance
Potential Commercial Applications
The potential commercial applications of this technology could be seen in:
- Mobile devices
- Automotive electronics
- Data centers
Possible Prior Art
One possible prior art could be:
- Semiconductor packages with integrated thermal management systems
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions?
This article does not provide a direct comparison to existing semiconductor packaging solutions. Further research or a comparative analysis would be needed to address this question.
What specific industries could benefit the most from this technology?
While the article mentions potential applications in consumer electronics, automotive systems, and industrial machinery, a more in-depth analysis would be required to determine the specific industries that could benefit the most from this technology.
Original Abstract Submitted
Disclosed is a semiconductor package comprising a lower circuit part having a first region and a second region horizontally offset from each other and including a connection structure within the first region and a logic chip within the second region, a memory structure that overlaps the connection structure in a vertical direction, and a thermal radiation structure that overlaps the logic chip in the vertical direction. The logic chip and the memory structure are spaced apart in a horizontal direction parallel to a top surface of the logic chip.
