18217020. SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM
Organization Name
Inventor(s)
Hyunwoong Choi of Suwon-si (KR)
Beomsoo Hwang of Suwon-si (KR)
SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18217020 titled 'SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM
Simplified Explanation
The semiconductor processing device described in the abstract is a system that uses a combination of laser and camera sensors to detect defects on a bare wafer during the manufacturing process. Here is a simplified explanation of the patent application:
- The device includes a stage for holding the bare wafer, a laser sensor above the stage to measure distance to the wafer, a camera sensor to capture images of the wafer, a lighting device to illuminate the wafer, and a controller to analyze the images and detect defects.
- The controller rotates the wafer on the stage to capture multiple sub-images and generate an original image of the wafer.
- Defects are detected using the original image and by measuring the distance between the laser sensor and the wafer while rotating it.
- Potential Applications
This technology can be used in semiconductor manufacturing processes to improve quality control and ensure defect-free wafers.
- Problems Solved
This technology helps in early detection of defects in bare wafers, leading to improved yield and reduced manufacturing costs.
- Benefits
The benefits of this technology include increased efficiency, improved product quality, and cost savings in semiconductor manufacturing processes.
- Potential Commercial Applications
This technology can be applied in semiconductor fabrication facilities to enhance wafer inspection processes and optimize production efficiency.
- Possible Prior Art
One possible prior art for this technology could be automated wafer inspection systems that use similar sensor technologies for defect detection in semiconductor manufacturing.
- Unanswered Questions
- How does this technology compare to traditional wafer inspection methods?
This article does not provide a direct comparison between this technology and traditional wafer inspection methods. It would be helpful to understand the specific advantages and limitations of this new approach.
- What is the cost-effectiveness of implementing this technology in semiconductor manufacturing?
The abstract does not mention the cost implications of integrating this technology into semiconductor processing devices. Understanding the cost-effectiveness of this innovation is crucial for decision-making in manufacturing facilities.
Original Abstract Submitted
A semiconductor processing device includes a stage configured to receive a bare wafer placed thereon, a laser sensor located above the stage in a vertical direction, orthogonal to an upper surface of the bare wafer, a camera sensor located above the stage in a first direction, a lighting device radiating an imaging region imaged by camera sensor with light, and a controller, configured to rotate the bare wafer using the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare ware, and detect a first defect of the bare wafer using the original image, wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the bare wafer using the stage.
