18354869. MEMORY DEVICE AND SYSTEM DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 MEMORY DEVICE AND SYSTEM DEVICE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MEMORY DEVICE AND SYSTEM DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MEMORY DEVICE AND SYSTEM DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Eungchang Lee of Suwon-si (KR)
Yunkyeong Jeong of Suwon-si (KR)
Chul-Hwan Choo of Suwon-si (KR)
MEMORY DEVICE AND SYSTEM DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18354869 titled 'MEMORY DEVICE AND SYSTEM DEVICE INCLUDING THE SAME
Simplified Explanation
The memory device described in the patent application includes a base die with a data signal bump, a first memory stack, and a second memory stack stacked on the base die. The base die can selectively provide the data signal to either the first memory stack or the second memory stack based on a selection signal.
- Base die with data signal bump
- First memory stack stacked on the base die
- Second memory stack spaced from the first memory stack
- Base die selectively provides data signal to either memory stack based on selection signal
Potential Applications
The technology described in this patent application could be applied in various memory devices such as solid-state drives, mobile devices, and servers.
Problems Solved
This technology solves the problem of efficiently managing data signals in memory devices with multiple memory stacks stacked on a base die.
Benefits
The benefits of this technology include improved data signal management, increased efficiency in memory devices, and potentially higher performance in data transfer.
Potential Commercial Applications
- "Innovative Memory Device Technology for Enhanced Data Signal Management"
Possible Prior Art
One possible prior art for this technology could be memory devices with similar stacking configurations but without the selective data signal provision feature.
Unanswered Questions
== How does the selection signal determine which memory stack receives the data signal? The patent application does not provide specific details on how the selection signal mechanism works to determine which memory stack receives the data signal.
== What are the specific technical specifications of the data signal bump on the base die? The patent application does not elaborate on the technical specifications or design of the data signal bump on the base die.
Original Abstract Submitted
A memory device includes a base die that includes a data signal bump configured to receive a data signal, a first memory stack that includes first memory dies sequentially stacked on the base die, and a second memory stack that includes second memory dies sequentially stacked on the base die and spaced from the first memory stack in a direction parallel to an upper surface of the base die. The base die is configured to selectively provide the data signal received through the data signal bump to one of the first memory stack or the second memory stack based on a selection signal.
