18336217. SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM
Organization Name
Inventor(s)
SANGJINE Park of Suwon-si (KR)
SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18336217 titled 'SUBSTRATE CLEANING CHAMBER, A SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME, AND A METHOD OF PROCESSING A SUBSTRATE USING THE SUBSTRATE PROCESSING SYSTEM
Simplified Explanation
The method described in the patent application involves wetting a substrate, using a supercritical fluid to dry the substrate, and then cleaning the dried substrate by applying a cleaning solution to both the top and bottom surfaces.
- Wetting of substrate
- Drying of substrate using supercritical fluid
- Cleaning of dried substrate with a cleaning solution applied to both surfaces
Potential Applications
The technology could be applied in industries such as semiconductor manufacturing, pharmaceuticals, and electronics for cleaning and processing substrates.
Problems Solved
This method provides an efficient and effective way to clean and process substrates, reducing the risk of contamination and improving overall product quality.
Benefits
- Improved cleanliness and quality of substrates - Reduced risk of contamination - Increased efficiency in substrate processing
Potential Commercial Applications
"Supercritical Fluid Substrate Cleaning and Processing Technology in Semiconductor Manufacturing"
Possible Prior Art
There are existing methods for cleaning and processing substrates, such as using solvents or traditional drying methods. However, the use of supercritical fluids for drying and cleaning substrates may offer advantages in terms of efficiency and effectiveness.
Unanswered Questions
How cost-effective is this method compared to traditional cleaning and processing techniques?
The cost-effectiveness of this method compared to traditional techniques would be an important factor for industries considering adopting this technology.
Are there any limitations or specific substrate types that may not be suitable for this method?
Understanding any limitations or specific substrate types that may not be compatible with this technology would be crucial for potential users to know.
Original Abstract Submitted
A method of processing a substrate includes wetting a substrate, supplying a supercritical fluid onto the wetted substrate to dry the substrate, and cleaning the dried substrate. The cleaning of the substrate includes supplying a cleaning solution onto a top surface of the substrate, and supplying a cleaning solution onto a bottom surface of the substrate.
