Huawei technologies co., ltd. (20240178160). PACKAGE STRUCTURE AND ELECTRONIC APPARATUS simplified abstract
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
Organization Name
Inventor(s)
Zhiqiang Xiang of Shenzhen (CN)
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178160 titled 'PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
Simplified Explanation
The patent application describes a package structure and an electronic apparatus that includes a power semiconductor device, a wire, and a shape memory object. The wire is electrically connected to the power semiconductor device, and the shape memory object is in contact with the wire. The shape memory object is designed to deform when its temperature is not less than a preset temperature, cutting off or reducing the current in the wire. This helps reduce the impact of high temperatures generated by the power semiconductor device during an overcurrent situation, thus protecting the printed circuit board from damage and implementing an overcurrent self-protection capability.
- Power semiconductor device
- Wire
- Shape memory object
- Deformation at preset temperature
- Overcurrent self-protection capability
Potential Applications
The technology can be applied in various electronic devices and systems where overcurrent protection is crucial, such as power supplies, inverters, motor drives, and industrial control systems.
Problems Solved
1. Damage to printed circuit boards due to high temperatures during overcurrent situations. 2. Lack of efficient overcurrent self-protection capabilities in package structures.
Benefits
1. Reduced risk of printed circuit board damage. 2. Enhanced overcurrent self-protection capability. 3. Improved reliability and longevity of electronic devices.
Potential Commercial Applications
Optimizing Overcurrent Self-Protection in Electronic Devices
Possible Prior Art
There may be prior art related to overcurrent protection mechanisms in electronic devices, but specific examples are not provided in the abstract.
Unanswered Questions
How does the shape memory object deform at the preset temperature?
The exact mechanism by which the shape memory object deforms to cut off or reduce the current in the wire is not detailed in the abstract. Further information on this process would be beneficial for a deeper understanding of the technology.
What materials are used in the shape memory object?
The abstract does not specify the materials used in the shape memory object. Understanding the composition of this object could provide insights into its performance and durability in practical applications.
Original Abstract Submitted
a package structure and an electronic apparatus includes a power semiconductor device, a wire, and a shape memory object. the wire is electrically connected to the power semiconductor device, the shape memory object is in contact with the wire, and the shape memory object is configured to deform when temperature of the shape memory object is not less than preset temperature, to enable a current in the wire to be cut off or reduced. in this way, impact of high temperature generated by the power semiconductor device when an overcurrent occurs in the power semiconductor device on the printed circuit board is reduced, a possibility that a printed circuit board is damaged is greatly reduced, and an overcurrent self-protection capability of the package structure is implemented.