3D Printing patent applications on May 30th, 2024

Patent Applications for 3D Printing on May 30th, 2024

Number of patent applications containing '3D Printing' or its variations: 8

XEROX CORPORATION (20240173769). DYNAMIC IN-FLIGHT CHARACTERIZATION OF BUILD MATERIAL IN A 3D PRINTER AND SYSTEM AND METHODS THEREOF simplified abstract

Organization: XEROX CORPORATION

Inventor(s): Douglas K. HERRMANN of Webster NY (US) for XEROX CORPORATION, Jason M. LeFEVRE of Penfield NY (US) for XEROX CORPORATION, Seemit PRAHARAJ of Webster NY (US) for XEROX CORPORATION, Varun SAMBHY of Pittsford NY (US) for XEROX CORPORATION

IPC Code(s): B22D23/00, B22D46/00, B33Y10/00, B33Y30/00, B33Y50/02

SprintRay Inc. (20240173913). APPARATUS AND METHOD FOR THREE-DIMENSIONAL PRINTING simplified abstract

Organization: SprintRay Inc.

Inventor(s): Jing Zhang of Los Angeles CA (US) for SprintRay Inc.

IPC Code(s): B29C64/124, B29C64/188, B29C64/205, B29C64/241, B29C64/245, B29C64/255, B29C64/264, B29C64/393, B33Y10/00, B33Y30/00, B33Y40/20, B33Y50/02

Eichenauer Heizelemente GmbH & Co. KG (20240173916). PRINT HEAD FOR A 3D PRINTER simplified abstract

Organization: Eichenauer Heizelemente GmbH & Co. KG

Inventor(s): Philippe Leininger of Haguenau (FR) for Eichenauer Heizelemente GmbH & Co. KG, Ulrich Schlachter of Herxheim (DE) for Eichenauer Heizelemente GmbH & Co. KG

IPC Code(s): B29C64/209, B29C64/295, B33Y30/00

Markforged, Inc. (20240173922). 3D PATHING WITH COMPENSATION FOR NOZZLE MOVEMENT simplified abstract

Organization: Markforged, Inc.

Inventor(s): Corey Hazeltine Walsh of Belmont MA (US) for Markforged, Inc., Suhas Nawada of Concord MA (US) for Markforged, Inc., Benjamin Gallup of Acton MA (US) for Markforged, Inc.

IPC Code(s): B29C64/386, B22F10/85, B22F12/90, B29C64/118, B29C64/393, B33Y50/00, B33Y50/02

Florida State University Research Foundation, Inc. (20240173924). SYSTEMS AND METHODS FOR ERROR REDUCTION IN THREE-DIMENSIONAL (3D) PRINTING simplified abstract

Organization: Florida State University Research Foundation, Inc.

Inventor(s): Hui Wang of Tallahassee FL (US) for Florida State University Research Foundation, Inc., An-Tsun Wei of Tallahassee FL (US) for Florida State University Research Foundation, Inc.

IPC Code(s): B29C64/393, B33Y30/00, B33Y50/02

3D Systems, Inc. (20240174781). FLAME RESISTANT BUILD MATERIALS AND ASSOCIATED PRINTED 3D ARTICLES simplified abstract

Organization: 3D Systems, Inc.

Inventor(s): Khalil MOUSSA of Rock Hill SC (US) for 3D Systems, Inc.

IPC Code(s): C08F222/22, B29C64/106, B33Y10/00, B33Y70/00, B33Y80/00, C08K5/00, C08K5/521

NIPPI, INCORPORATED (20240174976). BIOINK, MOLDED BODY, ARTICLE, AND METHOD FOR PRODUCING MOLDED BODY simplified abstract

Organization: NIPPI, INCORPORATED

Inventor(s): Shinomi Yagi of Tokyo (JP) for NIPPI, INCORPORATED, Keisuke Tanaka of Tokyo (JP) for NIPPI, INCORPORATED, Shunji Hattori of Tokyo (JP) for NIPPI, INCORPORATED, Kazunori Mizuno of Tokyo (JP) for NIPPI, INCORPORATED, Masataka Tanaka of Tokyo (JP) for NIPPI, INCORPORATED, Kazuyosi Sato of Tokyo (JP) for NIPPI, INCORPORATED

IPC Code(s): C12N5/00, B33Y10/00, B33Y70/00, B33Y80/00

FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. (20240177887). CORE WIRE AND METHOD OF MAKING SAME AND CABLE INCLUDING THE CORE WIRE simplified abstract

Organization: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.

Inventor(s): CHUN-LIN LEE of New Taipei (TW) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Jian-Guo Cai of Kunshan (CN) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Juan Zheng of Kushan (CN) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., Lu-Yu Chang of New Taipei (TW) for FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.

IPC Code(s): H01B7/02, H01B1/02, H01B5/12, H01B13/22