18298956. SEMICONDUCTOR DEVICE INCLUDING GUARD RING simplified abstract (SK hynix Inc.)

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SEMICONDUCTOR DEVICE INCLUDING GUARD RING

Organization Name

SK hynix Inc.

Inventor(s)

Bin Woo of Icheon (KR)

Seung In Shin of Icheon (KR)

SEMICONDUCTOR DEVICE INCLUDING GUARD RING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18298956 titled 'SEMICONDUCTOR DEVICE INCLUDING GUARD RING

Simplified Explanation

The semiconductor device described in the abstract includes a semiconductor substrate and a guard ring with conductive patterns stacked over the substrate and spaced apart from each other, with conductive plugs between adjacent patterns.

  • The semiconductor device consists of a semiconductor substrate.
  • The guard ring is made up of multiple conductive patterns stacked over the substrate.
  • The conductive patterns are spaced apart from each other in a perpendicular direction to the top surface of the semiconductor substrate.
  • A conductive plug is placed between two adjacent conductive patterns among the stacked patterns.
  • The conductive plug comprises long patterns and short patterns.

Potential Applications

The technology described in this patent application could be applied in:

  • Semiconductor manufacturing
  • Integrated circuit design
  • Electronics industry

Problems Solved

This technology helps in:

  • Enhancing the performance of semiconductor devices
  • Improving the reliability of electronic components
  • Minimizing signal interference in circuits

Benefits

The benefits of this technology include:

  • Increased efficiency in semiconductor devices
  • Enhanced signal integrity
  • Better protection against electrical noise

Potential Commercial Applications

With its advantages, this technology could find applications in:

  • Consumer electronics
  • Telecommunications
  • Automotive electronics

Possible Prior Art

One possible prior art related to this technology is the use of guard rings in semiconductor devices to protect against electrical interference.

Unanswered Questions

How does this technology compare to existing guard ring designs in terms of performance and reliability?

The article does not provide a direct comparison with other guard ring designs to assess its superiority.

What are the specific manufacturing processes involved in implementing this technology in semiconductor devices?

The article does not delve into the detailed manufacturing processes required for incorporating this innovation into semiconductor devices.


Original Abstract Submitted

A semiconductor device includes: a semiconductor substrate; and a guard ring including a plurality of conductive patterns stacked over the semiconductor substrate in a first direction to be spaced apart from each other, and a conductive plug disposed between two adjacent conductive patterns among the plurality of conductive patterns, the first direction being perpendicular to a top surface of the semiconductor substrate, wherein the conductive plug includes a plurality of long patterns and a plurality of short patterns.