18315432. SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract (SK hynix Inc.)
Contents
- 1 SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does the defect detection circuit identify and differentiate between various types of defects in the bonding pads and lines of the semiconductor device?
- 1.9.3 What is the impact of implementing this defect detection circuit on the overall cost and efficiency of semiconductor manufacturing processes?
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT
Organization Name
Inventor(s)
Young Ock Hong of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18315432 titled 'SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT
Simplified Explanation
The semiconductor device described in the abstract includes a defect detection circuit that connects upper and lower bonding pads through lines and a detection circuit.
- The semiconductor device has a plurality of upper bonding pads and lower bonding pads adhered to each other.
- A first upper line connects upper bonding pads to each other.
- A plurality of lower lines are connected to the lower bonding pads.
- The first defect detection circuit includes an input terminal connected to a lower line and an output terminal connected to another lower line.
Potential Applications
This technology could be used in the manufacturing and testing of semiconductor devices to detect defects in the bonding pads and lines.
Problems Solved
This technology helps in identifying defects in the bonding pads and lines of semiconductor devices, ensuring the quality and reliability of the devices.
Benefits
The defect detection circuit improves the overall quality control process in semiconductor manufacturing, leading to more reliable and efficient devices.
Potential Commercial Applications
"Improving Quality Control in Semiconductor Manufacturing with Defect Detection Circuits"
Possible Prior Art
There may be prior art related to defect detection circuits in semiconductor devices, but specific examples are not provided in this abstract.
Unanswered Questions
How does the defect detection circuit identify and differentiate between various types of defects in the bonding pads and lines of the semiconductor device?
The abstract does not provide details on the specific mechanisms or techniques used by the defect detection circuit to identify different types of defects.
What is the impact of implementing this defect detection circuit on the overall cost and efficiency of semiconductor manufacturing processes?
The abstract does not address the potential cost implications or efficiency improvements that may result from integrating this defect detection circuit into semiconductor manufacturing processes.
Original Abstract Submitted
There is provided a semiconductor device having a defect detection circuit. The semiconductor device includes a plurality of upper bonding pads, a plurality of lower bonding pads adhered to the plurality of upper bonding pads, a first upper line electrically connecting upper bonding pads, among the plurality of upper bonding pads, to each other; a plurality of lower lines electrically connected to the plurality of lower bonding pads; and a first defect detection circuit including an input terminal connected to a lower line, among the plurality of lower lines and an output terminal connected to another lower line, among the plurality of lower lines.
