18535893. PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION simplified abstract (Google LLC)
Contents
- 1 PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
Organization Name
Inventor(s)
Erik Anthony Lucero of Goleta CA (US)
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18535893 titled 'PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
Simplified Explanation
The patent application describes a stacked device with a quantum information processing device on a first substrate, bonded to a second substrate with bump bonds and pillars providing electrical connections and separation distance.
- The device includes a first substrate with a quantum information processing device.
- A second substrate is bonded to the first substrate.
- Multiple bump bonds provide electrical connections between the substrates.
- At least one pillar defines a separation distance between the substrates.
- The cross-sectional area of each pillar is greater than that of each bump bond.
Potential Applications
This technology could be applied in:
- Quantum computing
- Semiconductor manufacturing
- Advanced electronics
Problems Solved
This technology addresses issues such as:
- Improving electrical connections in stacked devices
- Providing separation distance between substrates
- Enhancing performance of quantum information processing devices
Benefits
The benefits of this technology include:
- Increased efficiency in quantum information processing
- Enhanced reliability of stacked devices
- Improved overall performance of electronic systems
Potential Commercial Applications
Potential commercial applications of this technology could be seen in:
- Data centers
- Telecommunications
- Aerospace industry
Possible Prior Art
One possible prior art for this technology could be:
- Stacked semiconductor devices with bump bonds and pillars for electrical connections.
Unanswered Questions
How does this technology impact the scalability of quantum computing devices?
This article does not delve into the scalability aspect of quantum computing devices with this technology.
What are the cost implications of implementing this technology in electronic systems?
The article does not discuss the cost implications of integrating this technology into electronic systems.
Original Abstract Submitted
A stacked device including a first substrate that includes a quantum information processing device, a second substrate bonded to the first substrate, and multiple bump bonds and at least one pillar between the first substrate and the second substrate. Each bump bond of the multiple bump bonds provides an electrical connection between the first substrate and the second substrate. At least one pillar defines a separation distance between a first surface of the first substrate and a first surface of the second substrate. A cross-sectional area of each pillar is greater than a cross-sectional area of each bump bond of the multiple bump bonds, where the cross-sectional area of each pillar and of each bump bond is defined along a plane parallel to the first surface of the first substrate or to the first surface of the second substrate.
