18503560. LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE simplified abstract (Micron Technology, Inc.)
Contents
- 1 LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kelvin Aik Boo Tan of Singapore (SG)
See Hiong Leow of Singapore (SG)
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18503560 titled 'LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor device assembly described in the abstract includes a substrate, multiple first electrical contacts on the substrate, a load switch with multiple second electrical contacts, and wire bonds connecting the first and second electrical contacts.
- The semiconductor device assembly consists of a substrate with first electrical contacts.
- A load switch is attached to the substrate with second electrical contacts on its outer surface.
- Wire bonds are used to connect the first electrical contacts on the substrate to the second electrical contacts on the load switch.
Potential Applications
This technology could be applied in various electronic devices such as power management systems, sensors, and communication devices.
Problems Solved
This technology solves the problem of efficiently transferring electrical signals between different components in a semiconductor device assembly.
Benefits
The benefits of this technology include improved electrical connectivity, enhanced performance, and increased reliability of semiconductor device assemblies.
Potential Commercial Applications
One potential commercial application of this technology is in the manufacturing of high-performance electronic devices for industries such as automotive, aerospace, and telecommunications.
Possible Prior Art
Prior art may include similar semiconductor device assemblies with wire bonds connecting different electrical contacts, but the specific configuration described in this patent application may be novel and inventive.
Unanswered Questions
How does this technology compare to existing wire bonding techniques in terms of efficiency and reliability?
This article does not provide a direct comparison between this technology and existing wire bonding techniques.
What are the potential limitations or challenges in implementing this technology on a larger scale in semiconductor manufacturing processes?
The article does not address the potential limitations or challenges in scaling up the implementation of this technology in semiconductor manufacturing processes.
Original Abstract Submitted
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a substrate and multiple first electrical contacts disposed on the substrate. The semiconductor device assembly may include a load switch coupled to the substrate and including a first outer surface facing the substrate and an opposing second outer surface facing away from the substrate. The load switch may include multiple second electrical contacts disposed on the second outer surface. The semiconductor device assembly may include multiple wire bonds electrically coupling the load switch to the substrate, wherein each wire bond electrically couples a corresponding first electrical contact, of the multiple first electrical contacts, to a corresponding second electrical contact, of the multiple second electrical contacts.
