18054637. SEMICONDUCTOR DEVICE HAVING CONTACT PLUG simplified abstract (Micron Technology, Inc.)
Contents
- 1 SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE HAVING CONTACT PLUG - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Organization Name
Inventor(s)
KEIICHI Tsuchiya of Higashihiroshima (JP)
KEIZO Kawakita of Higashihiroshima (JP)
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG - A simplified explanation of the abstract
This abstract first appeared for US patent application 18054637 titled 'SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Simplified Explanation
The patent application describes an apparatus with a unique contact plug design connecting two conductive patterns at different wiring layers in a semiconductor device.
- The apparatus includes a first conductive pattern at a lower wiring layer, a second conductive pattern at a higher wiring layer, and a contact plug connecting the two patterns.
- The contact plug has a lower conductive section contacting the first pattern and an upper conductive section contacting the second pattern.
- The upper conductive section has a smaller maximum width in one direction compared to the lower conductive section.
Potential Applications
This technology could be applied in the semiconductor industry for improving the efficiency and performance of integrated circuits.
Problems Solved
This innovation solves the problem of efficiently connecting conductive patterns at different wiring layers in a semiconductor device.
Benefits
The benefits of this technology include enhanced connectivity, reduced signal interference, and improved overall functionality of semiconductor devices.
Potential Commercial Applications
A potential commercial application of this technology could be in the manufacturing of advanced microprocessors for computers and other electronic devices.
Possible Prior Art
Prior art related to this technology may include patents or publications discussing contact plug designs in semiconductor devices.
Unanswered Questions
How does this technology compare to existing contact plug designs in terms of performance and reliability?
This article does not provide a direct comparison with existing contact plug designs in semiconductor devices.
What are the potential challenges in implementing this technology on a large scale in semiconductor manufacturing processes?
The article does not address the potential challenges that may arise in scaling up the production of semiconductor devices using this technology.
Original Abstract Submitted
An apparatus that includes a first conductive pattern positioned at a first wiring layer and extending in a first direction, a second conductive pattern positioned at a second wiring layer located above the first wiring layer and extending in a second direction crossing the first direction, and a contact plug connecting the first conductive pattern with the second conductive pattern. The contact plug includes a lower conductive section contacting the first conductive pattern and an upper conductive section contacting the second conductive pattern. A maximum width of the upper conductive section in the first direction is smaller than a maximum width of the lower conductive section in the first direction.
