18407062. INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES simplified abstract (Micron Technology, Inc.)
Contents
- 1 INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES
Organization Name
Inventor(s)
Kang-Yong Kim of Boise ID (US)
INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18407062 titled 'INTERNAL AND EXTERNAL DATA TRANSFER FOR STACKED MEMORY DIES
Simplified Explanation
The abstract of the patent application describes a memory stack where some memory dies are connected externally and act as interface dies, while others are connected internally through cascading connections for signal transmission.
- Memory dies in a stack can be connected externally or internally.
- External connections can act as interface dies for other memory dies.
- External connections are used for transmitting data signals.
- Internal connections are used for transmitting command, address, power, ground signals, etc.
Potential Applications
The technology described in the patent application could be applied in:
- High-speed data processing systems
- Memory-intensive applications like AI and machine learning
Problems Solved
This technology solves the following problems:
- Efficient signal transmission within memory stacks
- Simplified interface connections for memory dies
Benefits
The benefits of this technology include:
- Improved data transmission speeds
- Enhanced memory stack performance
- Simplified memory stack design and connectivity
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Data centers
- High-performance computing systems
Possible Prior Art
One possible prior art for this technology could be:
- Memory stack designs with only internal connections
Unanswered Questions
How does this technology impact power consumption in memory stacks?
This article does not address the specific impact of this technology on power consumption within memory stacks.
Are there any limitations to the number of memory dies that can be connected externally?
The article does not mention any limitations on the number of memory dies that can be connected externally.
Original Abstract Submitted
Some memory dies in a stack can be connected externally to the stack and other memory dies in the stack can be connected internally to the stack. The memory dies that are connected externally can act as interface dies for other memory dies that are connected internally thereto. The external connections can be used for transmitting signals indicative of data to and/or from the memory dies while the memory dies in the stack can be connected by a cascading connection for transmission of other signals such as command, address, power, ground, etc.
