18054211. PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract (Intel Corporation)
Contents
- 1 PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Changhua Liu of Chandle AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Mohammad Mamunur Rahman of Gilbert AZ (US)
PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18054211 titled 'PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS
Simplified Explanation
The abstract describes a package substrate with a conductive via in a first layer, a conductive trace in a second layer, and an insulative material between the two layers that absorbs electromagnetic radiation in a specific wavelength range. The layers are made of different types of photo-imageable dielectrics that react differently to exposure to electromagnetic radiation.
- Conductive via in first layer
- Conductive trace in second layer
- Insulative material between layers absorbs electromagnetic radiation
- Positive-type photo-imageable dielectric in first layer
- Negative-type photo-imageable dielectric in second layer
- Layers react differently to exposure to electromagnetic radiation
Potential Applications
This technology could be used in electronic packaging, integrated circuits, and other semiconductor devices.
Problems Solved
This technology helps in reducing electromagnetic interference and improving signal integrity in electronic devices.
Benefits
The benefits of this technology include improved performance, reliability, and efficiency of electronic devices.
Potential Commercial Applications
Potential commercial applications of this technology include consumer electronics, telecommunications equipment, and automotive electronics.
Possible Prior Art
One possible prior art could be the use of photo-imageable dielectrics in electronic packaging to create conductive traces and vias.
Unanswered Questions
1. How does the insulative material specifically absorb electromagnetic radiation in the wavelength range mentioned? 2. What specific types of electronic devices would benefit the most from this technology?
Original Abstract Submitted
Embodiments of a package substrate includes: a conductive via in a first layer, the first layer comprising a positive-type photo-imageable dielectric; a conductive trace in a second layer, the second layer comprising a negative-type photo-imageable dielectric; and an insulative material between the first layer and the second layer, the insulative material configured to absorb electromagnetic radiation in a wavelength range between 10 nanometers and 800 nanometers. The conductive via is directly attached to the conductive trace through the insulative material, the positive-type photo-imageable dielectric is soluble in a photoresist developer upon exposure to the electromagnetic radiation, and the negative-type photo-imageable dielectric is insoluble in the photoresist developer upon exposure to the electromagnetic radiation.
