18418154. VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES simplified abstract (Intel Corporation)

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

Organization Name

Intel Corporation

Inventor(s)

Xiao Lu of Chandler AZ (US)

Jiongxin Lu of Chandler AZ (US)

Christopher Combs of Portland OR (US)

Alexander Huettis of Aloha OR (US)

John Harper of Chandler AZ (US)

Jieping Zhang of Mesa AZ (US)

Nachiket R. Raravikar of Gilbert AZ (US)

Pramod Malatkar of Chandler AZ (US)

Steven A. Klein of Chandler AZ (US)

Carl Deppisch of Tempe AZ (US)

Mohit Sood of Chandler AZ (US)

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18418154 titled 'VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

Simplified Explanation

The abstract describes an electronic package with a first substrate, a second substrate, and an array of interconnects coupling the substrates. The interconnects have different volumes and material compositions.

• The electronic package includes a first substrate, a second substrate, and an array of interconnects.
• The interconnects consist of first interconnects with a specific volume and material composition, and second interconnects with different volume and material composition.

Potential Applications

The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics where compact and efficient interconnects are required.

Problems Solved

This technology solves the problem of efficiently connecting different substrates in electronic packages while optimizing the volume and material composition of the interconnects for improved performance and reliability.

Benefits

The benefits of this technology include enhanced electrical connectivity between substrates, improved overall performance of electronic devices, and potentially reduced manufacturing costs due to optimized interconnect design.

Potential Commercial Applications

A potential commercial application of this technology could be in the semiconductor industry for manufacturing advanced electronic packages with improved interconnect designs for better performance and reliability.

Possible Prior Art

One possible prior art for this technology could be the use of different interconnect materials in electronic packages to optimize performance and reliability. Another could be the development of advanced interconnect designs for compact electronic devices.

How does this technology compare to existing interconnect designs in terms of performance and reliability?

This article does not provide a direct comparison between this technology and existing interconnect designs in terms of performance and reliability. Further research or testing may be needed to determine the advantages of this technology over existing solutions.

What are the potential challenges in implementing this technology on a large scale in electronic manufacturing processes?

The article does not address the potential challenges in implementing this technology on a large scale in electronic manufacturing processes. Factors such as scalability, cost-effectiveness, and compatibility with existing manufacturing equipment could be important considerations that need to be explored further.

Original Abstract Submitted

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.