17915707. DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
- 1 DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact the overall cost of manufacturing display modules?
- 1.11 What are the potential challenges in implementing this technology on a large scale?
- 1.12 Original Abstract Submitted
DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
Jingjing Zhang of Beijing (CN)
DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17915707 titled 'DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
Simplified Explanation
The display module described in the patent application includes a display panel with bonding electrodes divided into two groups, connected to two flexible circuit boards with different wiring regions and fan-out regions.
- The display panel has bonding electrodes arranged at intervals along a side edge, divided into two groups.
- The first flexible circuit board connects each first conductive contact piece in a first wiring region to a bonding electrode in the first group.
- The second flexible circuit board connects each second conductive contact piece in a second wiring region to a bonding electrode in the second group.
- The first wiring region is closer to the side edge than the second wiring region in one direction.
- The first fan-out region is spaced apart from the second wiring region in a perpendicular direction.
Potential Applications
The technology described in this patent application could be used in various display devices, such as smartphones, tablets, and monitors.
Problems Solved
This technology solves the problem of efficiently connecting bonding electrodes on a display panel to flexible circuit boards with different wiring regions.
Benefits
The benefits of this technology include improved reliability and flexibility in the design and manufacturing of display modules.
Potential Commercial Applications
The technology could be applied in the production of consumer electronics, automotive displays, and industrial control panels.
Possible Prior Art
One possible prior art for this technology could be the use of flexible circuit boards in display modules to connect bonding electrodes, but the specific arrangement described in this patent application may be novel.
Unanswered Questions
How does this technology impact the overall cost of manufacturing display modules?
The article does not provide information on how this technology may affect the cost of manufacturing display modules.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential challenges that may arise when implementing this technology on a large scale.
Original Abstract Submitted
A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.
- BOE TECHNOLOGY GROUP CO., LTD.
- Jing Wang of Beijing (CN)
- Mingming Jia of Beijing (CN)
- Lili Wang of Beijing (CN)
- Sha Feng of Beijing (CN)
- Chao Liu of Beijing (CN)
- Ming Zhai of Beijing (CN)
- Haiwei Sun of Beijing (CN)
- Lingyun Shi of Beijing (CN)
- Liqiang Wang of Beijing (CN)
- Jingjing Zhang of Beijing (CN)
- H05K1/18
- H01L23/00
- H01L25/075
- H05K1/11