17781013. METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
- 1 METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17781013 titled 'METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE
Simplified Explanation
The present disclosure describes a method for forming a conductive via in a dielectric layer for electronic elements.
- Preparation of a dielectric layer
- Formation of a connection via through the dielectric layer
- Formation of a connection electrode in the via
- Formation of first and second extraction electrodes on opposite surfaces of the dielectric layer
- Electrical connection between the extraction electrodes and the connection electrode
Potential Applications
The technology described in this patent application could be used in the manufacturing of electronic components such as integrated circuits, printed circuit boards, and semiconductor devices.
Problems Solved
This technology solves the problem of creating reliable and efficient conductive vias in dielectric layers for electronic components.
Benefits
The benefits of this technology include improved electrical connectivity, reduced signal loss, and increased overall performance of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing, and telecommunications sector.
Possible Prior Art
One possible prior art for this technology could be the methods and techniques used in the fabrication of integrated circuits and printed circuit boards.
Unanswered Questions
How does this technology compare to existing methods for forming conductive vias in dielectric layers?
This article does not provide a direct comparison with existing methods for forming conductive vias in dielectric layers.
What are the specific materials and processes involved in the formation of the connection electrode and extraction electrodes?
The article does not delve into the specific materials and processes used in the formation of the connection electrode and extraction electrodes.
Original Abstract Submitted
The present disclosure provides a method for forming a conductive via, and belongs to the technical field of electronic elements. The present method includes: preparing a dielectric layer, and forming a connection via, which extends through the dielectric layer in a thickness direction of the dielectric layer, in the dielectric layer; wherein the dielectric layer includes a first surface and a second surface oppositely arranged in the thickness direction of the dielectric layer; forming a connection electrode in the connection via, forming a first extraction electrode on the first surface, and forming a second extraction electrode on the second surface; wherein the connection electrode at least covers an inner wall of the connection via, and the first extraction electrode and the second extraction electrode are electrically connected to the connection electrode.
