Taiwan Semiconductor Manufacturing Co., Ltd. patent applications published on May 16th, 2024
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on May 16th, 2024
- 1.1 BOX ERECTING APPARATUS AND METHOD (18415393)
- 1.2 TEMPERATURE MONITORING DEVICE AND METHOD (18421602)
- 1.3 METHOD OF MEASURING CHIP CHARACTERISTICS, TEST DEVICE AND NON-TRANSITORY COMPUTER READABLE MEDIA (18163888)
- 1.4 FOLDED WAVEGUIDE PHASE SHIFTERS (18424609)
- 1.5 METHOD AND APPARATUS FOR CONTROLLING DROPLET IN EXTREME ULTRAVIOLET LIGHT SOURCE (18421783)
- 1.6 Attribute-Point-Based Timing Constraint Formal Verification (18418546)
- 1.7 CONDUCTOR SCHEME SELECTION AND TRACK PLANNING FOR MIXED-DIAGONAL-MANHATTAN ROUTING (18512411)
- 1.8 INTEGRATED CIRCUIT LAYOUT GENERATION METHOD (18421644)
- 1.9 Memory Device (18447910)
- 1.10 INTEGRATED CIRCUIT DEVICE AND METHODS (18421683)
- 1.11 SIGNAL GENERATOR FOR CONTROLLING TIMING OF SIGNAL IN MEMORY DEVICE (18422908)
- 1.12 FERROELECTRIC MEMORY OPERATION BIAS AND POWER DOMAINS (18418880)
- 1.13 MEMORY DEVICE AND MANUFACTURING THEREOF (18110321)
- 1.14 MEMORY DEVICE WITH WORD LINE PULSE RECOVERY (18417325)
- 1.15 DIRECT WRITING SYSTEM USED FOR ELECTRON BEAM LITHOGRAPHY (18464243)
- 1.16 COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION (18308036)
- 1.17 Semiconductor Devices and Methods of Manufacturing (18419696)
- 1.18 MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL (18420068)
- 1.19 MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT (18417370)
- 1.20 BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES (18421155)
- 1.21 SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME (18424246)
- 1.22 INTEGRATED CIRCUIT DEVICE (18422726)
- 1.23 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME (18405040)
- 1.24 DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD (18423648)
- 1.25 Package with Improved Heat Dissipation Efficiency and Method for Forming the Same (18152615)
- 1.26 SEMICONDUCTOR DEVICE AND METHOD (18151008)
- 1.27 DIAGONAL VIA MANUFACTURING METHOD (18421552)
- 1.28 RESISTOR WITHIN A VIA (18415086)
- 1.29 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18423166)
- 1.30 THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES (18422550)
- 1.31 METHOD FOR FABRICATING DEVICE DIE (18418318)
- 1.32 SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION (18156847)
- 1.33 DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS (18422220)
- 1.34 SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME (18513619)
- 1.35 DEVICE OVER PHOTODETECTOR PIXEL SENSOR (18404178)
- 1.36 BOND PAD STRUCTURE FOR BONDING IMPROVEMENT (18419947)
- 1.37 MAGNETIC THIN FILM INDUCTOR STRUCTURES (18421191)
- 1.38 INTEGRATED CHIP AND METHOD OF FORMING THEREOF (18423616)
- 1.39 Gate Structures in Transistors and Method of Forming Same (18418678)
- 1.40 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF (18107658)
- 1.41 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (18180589)
- 1.42 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (18172877)
- 1.43 STRUCTURE AND METHOD FOR MULTI-GATE SEMICONDUCTOR DEVICES (18157448)
- 1.44 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18421398)
- 1.45 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (18180698)
- 1.46 INDEPENDENT CONTROL OF STACKED SEMICONDUCTOR DEVICE (18423738)
- 1.47 GATE RESISTANCE REDUCTION THROUGH LOW-RESISTIVITY CONDUCTIVE LAYER (18421681)
- 1.48 THREE-DIMENSIONAL MEMORY DEVICES (18406745)
- 1.49 ANNEALED SEED LAYER TO IMPROVE FERROELECTRIC PROPERTIES OF MEMORY LAYER (18419987)
- 1.50 Phase-Change Memory Device and Method (18423769)
- 1.51 RESISTIVE RANDOM ACCESS MEMORY DEVICE WITH IMPROVED BOTTOM ELECTRODE (18173815)
Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on May 16th, 2024
BOX ERECTING APPARATUS AND METHOD (18415393)
Main Inventor
Szu-Chen HUANG
TEMPERATURE MONITORING DEVICE AND METHOD (18421602)
Main Inventor
Po-Zeng KANG
METHOD OF MEASURING CHIP CHARACTERISTICS, TEST DEVICE AND NON-TRANSITORY COMPUTER READABLE MEDIA (18163888)
Main Inventor
Ting-Hao WANG
FOLDED WAVEGUIDE PHASE SHIFTERS (18424609)
Main Inventor
Huan-Neng CHEN
METHOD AND APPARATUS FOR CONTROLLING DROPLET IN EXTREME ULTRAVIOLET LIGHT SOURCE (18421783)
Main Inventor
Chi-Hung LIAO
Attribute-Point-Based Timing Constraint Formal Verification (18418546)
Main Inventor
Chao-Chun Lo
CONDUCTOR SCHEME SELECTION AND TRACK PLANNING FOR MIXED-DIAGONAL-MANHATTAN ROUTING (18512411)
Main Inventor
Sheng-Hsiung Chen
INTEGRATED CIRCUIT LAYOUT GENERATION METHOD (18421644)
Main Inventor
Ke-Ying SU
Memory Device (18447910)
Main Inventor
Chien-Chen Lin
INTEGRATED CIRCUIT DEVICE AND METHODS (18421683)
Main Inventor
Bo-Feng YOUNG
SIGNAL GENERATOR FOR CONTROLLING TIMING OF SIGNAL IN MEMORY DEVICE (18422908)
Main Inventor
Xiu-Li YANG
FERROELECTRIC MEMORY OPERATION BIAS AND POWER DOMAINS (18418880)
Main Inventor
Katherine H. CHIANG
MEMORY DEVICE AND MANUFACTURING THEREOF (18110321)
Main Inventor
Jhon Jhy LIAW
MEMORY DEVICE WITH WORD LINE PULSE RECOVERY (18417325)
Main Inventor
Wei-jer Hsieh
DIRECT WRITING SYSTEM USED FOR ELECTRON BEAM LITHOGRAPHY (18464243)
Main Inventor
Cheng-Hsien Chou
COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION (18308036)
Main Inventor
Kuo-Ming WU
Semiconductor Devices and Methods of Manufacturing (18419696)
Main Inventor
Jhon Jhy Liaw
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL (18420068)
Main Inventor
Chih-Hung HUANG
MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT (18417370)
Main Inventor
Chih-Hung HUANG
BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES (18421155)
Main Inventor
Shuen-Shin LIANG
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME (18424246)
Main Inventor
Hsin-Yen HUANG
INTEGRATED CIRCUIT DEVICE (18422726)
Main Inventor
Hsia-Wei CHEN
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME (18405040)
Main Inventor
Shih-Chuan CHIU
DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD (18423648)
Main Inventor
Kuan-Da Huang
Package with Improved Heat Dissipation Efficiency and Method for Forming the Same (18152615)
Main Inventor
Hung-Yi Kuo
SEMICONDUCTOR DEVICE AND METHOD (18151008)
Main Inventor
Ching-Yu Huang
DIAGONAL VIA MANUFACTURING METHOD (18421552)
Main Inventor
Shih-Wei PENG
RESISTOR WITHIN A VIA (18415086)
Main Inventor
Chi-Han YANG
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18423166)
Main Inventor
Chung-Hao Tsai
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES (18422550)
Main Inventor
Sung-Hui Huang
METHOD FOR FABRICATING DEVICE DIE (18418318)
Main Inventor
Shih-Wei Chen
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION (18156847)
Main Inventor
Wen-Shiang LIAO
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS (18422220)
Main Inventor
Wei-Jhih Mao
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME (18513619)
Main Inventor
Guan-Lin CHEN
DEVICE OVER PHOTODETECTOR PIXEL SENSOR (18404178)
Main Inventor
Jhy-Jyi Sze
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT (18419947)
Main Inventor
Sin-Yao Huang
MAGNETIC THIN FILM INDUCTOR STRUCTURES (18421191)
Main Inventor
Alan ROTH
INTEGRATED CHIP AND METHOD OF FORMING THEREOF (18423616)
Main Inventor
Meng-Han Lin
Gate Structures in Transistors and Method of Forming Same (18418678)
Main Inventor
Hsin-Yi Lee
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF (18107658)
Main Inventor
Pin Chun SHEN
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (18180589)
Main Inventor
Ta-Chun LIN
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (18172877)
Main Inventor
Huang-Chao CHANG
STRUCTURE AND METHOD FOR MULTI-GATE SEMICONDUCTOR DEVICES (18157448)
Main Inventor
Ko-Cheng Liu
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18421398)
Main Inventor
Wan-Yi Kao
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (18180698)
Main Inventor
Ming-Heng TSAI
INDEPENDENT CONTROL OF STACKED SEMICONDUCTOR DEVICE (18423738)
Main Inventor
Chansyun David YANG
GATE RESISTANCE REDUCTION THROUGH LOW-RESISTIVITY CONDUCTIVE LAYER (18421681)
Main Inventor
Chung-Chiang Wu
THREE-DIMENSIONAL MEMORY DEVICES (18406745)
Main Inventor
Meng-Han Lin
ANNEALED SEED LAYER TO IMPROVE FERROELECTRIC PROPERTIES OF MEMORY LAYER (18419987)
Main Inventor
Song-Fu Liao
Phase-Change Memory Device and Method (18423769)
Main Inventor
Tung Ying Lee
RESISTIVE RANDOM ACCESS MEMORY DEVICE WITH IMPROVED BOTTOM ELECTRODE (18173815)
Main Inventor
Jheng-Hong Jiang
