18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Wen-Shiang Liao of Toufen Township (TW)
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18156847 titled 'SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Simplified Explanation
The abstract describes a semiconductor die package with a dielectric waveguide for inter-die communication, utilizing high-k core and low-k cladding layers for efficient signal transmission.
- High-k core layer and low-k cladding layers enable loose coupling of signal modes and total internal reflections in the waveguide.
- The combination of semiconductor die package techniques and the dielectric waveguide allows for increased inter-die communication bandwidth, reduced footprint, and increased density.
Potential Applications
This technology could be applied in:
- High-speed data communication between semiconductor dies
- Advanced computing systems requiring high interconnectivity
Problems Solved
This technology addresses:
- Limited bandwidth in inter-die communication
- Space constraints in semiconductor die packages
Benefits
The benefits of this technology include:
- Increased inter-die communication bandwidth
- Reduced footprint and increased density in semiconductor die packages
Potential Commercial Applications
A potential commercial application for this technology could be:
- High-performance computing systems requiring efficient inter-die communication
Possible Prior Art
There may be prior art related to:
- Dielectric waveguides in semiconductor packaging
- Techniques for improving inter-die communication bandwidth
Unanswered Questions
How does this technology impact power consumption in semiconductor die packages?
This article does not address the potential impact of this technology on power consumption in semiconductor die packages. It would be interesting to explore whether the use of dielectric waveguides affects power efficiency.
What are the potential challenges in integrating this technology into existing semiconductor packaging processes?
The article does not discuss the challenges that may arise when integrating this technology into current semiconductor packaging processes. Understanding the obstacles and solutions for implementation would be crucial for practical application.
Original Abstract Submitted
Semiconductor dies in a semiconductor die package may communicate through a dielectric waveguide. The dielectric waveguide may include a high dielectric constant (high-k) core layer that is sandwiched by low dielectric constant (low-k) cladding layers. The difference in dielectric constants of the high-k core layer and the low-k cladding layers enables loose coupling of electromagnetic signal modes in the dielectric waveguide while providing a relatively low critical angle for achieving total internal reflections in the high-k core layer. Thus, the combination of semiconductor die package techniques described herein and the dielectric waveguide described herein may enable increased inter-die communication bandwidth while achieving a reduced footprint and increased density for semiconductor die packages.
