18422550. THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Sung-Hui Huang of Dongshan Township (TW)
Hsiang-Fan Lee of Hsinchu (TW)
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18422550 titled 'THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
Simplified Explanation
The patent application describes a package with a device die, a metal cap, and a thermal interface material between the device die and the metal cap. The thermal interface material has two portions of different thicknesses, with one portion directly over the device die and the other extending over a corner region of the device die.
- The package includes a device die and a metal cap with a thermal interface material between them.
- The thermal interface material has two portions of different thicknesses.
- One portion is directly over the device die, while the other extends over a corner region of the device die.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Electronic packaging
- Thermal management systems
- Semiconductor devices
Problems Solved
This technology helps to address the following issues:
- Heat dissipation in electronic devices
- Thermal stress management in semiconductor components
- Improving the reliability and performance of electronic systems
Benefits
The use of this technology offers the following benefits:
- Enhanced thermal conductivity
- Improved heat dissipation
- Increased reliability of electronic components
Potential Commercial Applications
The technology could find commercial applications in:
- Consumer electronics
- Automotive electronics
- Industrial automation systems
Possible Prior Art
One possible prior art for this technology could be the use of thermal interface materials in electronic packaging to improve heat dissipation and reliability.
What is the specific composition of the thermal interface material used in this technology?
The specific composition of the thermal interface material used in this technology is not provided in the abstract. Further details on the materials and their properties would be needed to answer this question.
How does the thickness of the two portions of the thermal interface material impact the overall thermal performance of the package?
The abstract does not mention how the thickness of the two portions of the thermal interface material affects the overall thermal performance of the package. This would require a more in-depth analysis of the patent application to determine the impact of the thickness on thermal conductivity and heat dissipation.
Original Abstract Submitted
A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
