18457548. DEVICE AND METHOD FOR MEASURING THICKNESS simplified abstract (SAMSUNG DISPLAY CO., LTD.)
Contents
- 1 DEVICE AND METHOD FOR MEASURING THICKNESS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DEVICE AND METHOD FOR MEASURING THICKNESS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
DEVICE AND METHOD FOR MEASURING THICKNESS
Organization Name
Inventor(s)
OHJUNE Kwon of Yongin-si, Gyeonggi-do (KR)
JINHO Hyun of Yongin-si, Gyeonggi-do (KR)
DEVICE AND METHOD FOR MEASURING THICKNESS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18457548 titled 'DEVICE AND METHOD FOR MEASURING THICKNESS
Simplified Explanation
The thickness measuring device described in the abstract includes an imaging unit positioned above an inspection substrate, which consists of a substrate with a pattern and an inspection layer on top. The imaging unit captures images of the inspection substrate to generate inspection image data, which is then used by a data calculating unit to determine the thickness of the inspection layer. The imaging unit is angled with respect to the inspection substrate, and the data calculating unit utilizes the coordinate value of the pattern in the inspection image data to calculate the thickness of the inspection layer.
- Imaging unit positioned above inspection substrate
- Inspection image data used to calculate thickness of inspection layer
- Data calculating unit utilizes coordinate value of pattern in image data
- Imaging unit angled with respect to inspection substrate
Potential Applications
This technology could be used in industries such as semiconductor manufacturing, where precise measurement of layer thickness is crucial for quality control and process optimization.
Problems Solved
This technology solves the problem of accurately measuring the thickness of thin layers on substrates, which is essential in various manufacturing processes to ensure product quality and performance.
Benefits
- Improved accuracy in measuring layer thickness - Enhanced quality control in manufacturing processes - Increased efficiency in production processes
Potential Commercial Applications
"Thickness Measuring Device for Semiconductor Manufacturing Industry"
Possible Prior Art
One possible prior art could be traditional methods of measuring layer thickness, such as using mechanical gauges or manual inspection techniques. These methods may not provide the same level of accuracy and efficiency as the device described in the patent application.
Unanswered Questions
How does the device handle variations in substrate materials and patterns?
The abstract does not provide information on how the device accounts for different types of substrates and patterns, which could affect the accuracy of the thickness measurements.
What is the cost-effectiveness of implementing this technology in manufacturing processes?
The abstract does not mention the cost implications of using this device in industrial settings, such as initial investment, maintenance costs, and potential savings from improved efficiency.
Original Abstract Submitted
A thickness measuring device includes an imaging unit disposed above an inspection substrate, which includes a substrate, a pattern provided on the substrate, and an inspection layer disposed on the pattern. The imaging unit images the inspection substrate to output inspection image data and a data calculating unit receives the inspection image data and calculates a thickness value of the inspection layer from the inspection image data, wherein the imaging unit is disposed inclined at a fixed angle with respect to the inspection substrate, and wherein the data calculating unit calculates the thickness value of the inspection layer using a coordinate value of the pattern from the inspection image data.
