18416937. ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)

ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE

Organization Name

HUAWEI TECHNOLOGIES CO., LTD.

Inventor(s)

Jun Luo of Wuhan (CN)

Zengguang Guo of Wuhan (CN)

Xiaokang Xiao of Dongguan (CN)

ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18416937 titled 'ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE

Simplified Explanation

The application describes an electrical lead-out structure for hermetic packaging, consisting of a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer with a window, while the packaging layer fills the window and is insulatingly adjacent to the electrical signal layer.

• The electrical lead-out structure includes a flexible circuit board and a packaging layer.
• The flexible circuit board has an electrical signal layer and a reinforcing layer with a window.
• The packaging layer fills the window and is insulatingly adjacent to the electrical signal layer.
• The structure forms a feed-through area for soldering to a hermetic housing.

Potential Applications

The technology can be applied in:

• Hermetic apparatus
• Optical communication devices

Problems Solved

The technology solves the problem of providing a reliable electrical lead-out structure for hermetic packaging.

Benefits

The benefits of this technology include:

• Improved reliability in hermetic packaging
• Enhanced performance in optical communication devices

Potential Commercial Applications

The potential commercial applications of this technology can be in:

• Telecommunications industry
• Electronics manufacturing sector

Possible Prior Art

One possible prior art could be traditional hermetic packaging methods that may not provide the same level of reliability and performance as the described electrical lead-out structure.

Unanswered Questions

How does the technology impact the overall cost of manufacturing hermetic apparatus?

The article does not provide information on the cost implications of implementing this technology in manufacturing processes.

Are there any limitations to the size or scale of devices that can be hermetically packaged using this technology?

The article does not address any potential limitations in terms of the size or scale of devices that can benefit from this electrical lead-out structure.

Original Abstract Submitted

This application provides an electrical lead-out structure and a preparation method thereof, a hermetic apparatus, and an optical communication device. The electrical lead-out structure is used for hermetic package. The electrical lead-out structure includes a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer that are stacked up, the reinforcing layer is provided with a window that passes through the reinforcing layer, the electrical signal layer is adjacent to the window, the packaging layer fills the window, and a side that is of the packaging layer and that faces the electrical signal layer is insulatingly adjacent to the electrical signal layer. The packaging layer is disposed on the flexible circuit board, so that in the electrical lead-out structure, a feed-through area used for soldering to a hermetic housing is formed.