18054160. BACKSIDE PROGRAMMABLE GATE ARRAY simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

BACKSIDE PROGRAMMABLE GATE ARRAY

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Albert M. Chu of Nashua NH (US)

Brent A. Anderson of Jericho VT (US)

Junli Wang of Slingerlands NY (US)

Albert M. Young of Fishkill NY (US)

Ruilong Xie of Niskayuna NY (US)

Carl Radens of LaGrangeville NY (US)

BACKSIDE PROGRAMMABLE GATE ARRAY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18054160 titled 'BACKSIDE PROGRAMMABLE GATE ARRAY

Simplified Explanation

The present invention relates to processing methods and resulting structures for integrated circuits with backside programmable gate arrays.

• Front end of line structure formed with an array of transistors, each including one or more placeholder backside vias.
• First portion of backside vias defines placeholder backside vias, while second portion defines programmed backside vias.
• Back end of line structure formed on the front end of line structure.
• Backside structure formed on the opposite surface of the front end of line structure, including a backside metallization layer in direct contact with the programmed backside vias.

Potential Applications

This technology could be applied in the semiconductor industry for the development of integrated circuits with programmable gate arrays on the backside.

Problems Solved

1. Allows for customization and reconfiguration of integrated circuits without the need for extensive physical modifications. 2. Enables efficient utilization of space on the integrated circuit by incorporating programmable gate arrays on the backside.

Benefits

1. Increased flexibility in circuit design and functionality. 2. Cost-effective solution for implementing programmable gate arrays in integrated circuits. 3. Enhanced performance and versatility of integrated circuits.

Potential Commercial Applications

"Integrated Circuits with Backside Programmable Gate Arrays: Revolutionizing Semiconductor Design"

Possible Prior Art

There may be prior art related to programmable gate arrays in integrated circuits, but the specific implementation of backside programmable gate arrays as described in this patent application may be novel.

Unanswered Questions

How does the backside metallization layer interact with the programmed backside vias to enhance circuit performance?

The article does not delve into the specific mechanisms through which the backside metallization layer improves the functionality of the integrated circuit.

Are there any limitations or drawbacks to the implementation of backside programmable gate arrays in integrated circuits?

The potential challenges or limitations of integrating programmable gate arrays on the backside of integrated circuits are not addressed in the article.

Original Abstract Submitted

Embodiments of the present invention are directed to processing methods and resulting structures for integrated circuits having backside programmable gate arrays. In a non-limiting embodiment, a front end of line structure having an array of transistors is formed such that each transistor of the array of transistors includes one or more placeholder backside vias. A first portion of the backside vias defines one or more placeholder backside vias and a second portion of the one or more backside vias defines one or more programmed backside vias. A back end of line structure is formed on a first surface of the front end of line structure. A backside structure is formed on a second surface of the front end of line structure opposite the first surface. The backside structure includes a backside metallization layer in direct contact with the one or more programmed backside vias.