17987823. STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
Contents
- 1 STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
Organization Name
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor(s)
Arvind Kumar of Chappaqua NY (US)
Todd Edward Takken of Brewster NY (US)
John W Golz of HOPEWELL JCT NY (US)
Joshua M. Rubin of Albany NY (US)
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT - A simplified explanation of the abstract
This abstract first appeared for US patent application 17987823 titled 'STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
Simplified Explanation
The semiconductor module described in the patent application consists of two semiconductor dies stacked on top of each other. The first die includes a power support structure and a cache region, while the second die includes a logic core and a cache region. The logic core is electrically connected to the power support structure of the first die, and the second cache region is connected to the first cache region.
- The semiconductor module includes two stacked semiconductor dies.
- The first die has a power support structure and a cache region.
- The second die has a logic core and a cache region.
- The logic core of the second die is connected to the power support structure of the first die.
- The second cache region is connected to the first cache region.
Potential Applications
The technology described in this patent application could be applied in:
- High-performance computing systems
- Data centers
- Artificial intelligence applications
Problems Solved
This technology helps in:
- Improving data processing speed
- Enhancing overall system performance
- Optimizing cache memory utilization
Benefits
The benefits of this technology include:
- Increased efficiency in data processing
- Enhanced system reliability
- Improved overall performance
Potential Commercial Applications
This technology could be commercially applied in:
- Server systems
- Supercomputers
- Networking equipment
Possible Prior Art
One possible prior art for this technology could be:
- Stacked semiconductor dies with different functionalities
Unanswered Questions
How does the power support structure enhance the performance of the semiconductor module?
The power support structure plays a crucial role in providing stable power supply to the logic core, ensuring consistent and reliable operation.
What are the specific design considerations for stacking the semiconductor dies in this configuration?
The design considerations may include thermal management, signal integrity, and electrical connectivity between the two dies to optimize performance and reliability.
Original Abstract Submitted
A semiconductor module includes a first semiconductor die, which comprises (i) a power support structure and (ii) a first cache region; and a second semiconductor die, which is mounted on top of the first semiconductor die and comprises (i) a logic core, which overlies and is electrically connected to the power support structure, and (ii) a second cache region, which overlies and is electrically connected to the first cache region.
