18054991. AIRGAP SPACER FOR POWER VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

AIRGAP SPACER FOR POWER VIA

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Kisik Choi of Watervliet NY (US)

Huai Huang of Clifton Park NY (US)

AIRGAP SPACER FOR POWER VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 18054991 titled 'AIRGAP SPACER FOR POWER VIA

Simplified Explanation

The semiconductor device described in the patent application includes an airgap spacer for power via, which helps maintain parasitic capacitance below a threshold level. The device comprises a power bar wired to a backside power rail, with airgaps between the power bar and the gates of field effect transistors.

• The semiconductor device includes a power bar connected to a backside power rail.
• Airgaps are present between the power bar and the gates of field effect transistors.
• The airgaps help keep parasitic capacitance in the device below a certain threshold.

Potential Applications

The technology could be applied in:

• High-performance computing systems
• Power management circuits
• Integrated circuits for consumer electronics

Problems Solved

The technology helps address issues related to:

• Parasitic capacitance in semiconductor devices
• Power efficiency in electronic systems

Benefits

The benefits of this technology include:

• Improved performance of semiconductor devices
• Enhanced power efficiency
• Reduced parasitic capacitance

Potential Commercial Applications

The technology could find applications in:

• Semiconductor manufacturing companies
• Electronics and consumer goods industries
• Research and development organizations

Possible Prior Art

One possible prior art could be the use of airgaps in semiconductor devices to reduce parasitic capacitance. Another could be the integration of power bars in electronic circuits to improve power distribution efficiency.

Unanswered Questions

How does the presence of airgaps impact the overall size of the semiconductor device?

The article does not provide information on whether the inclusion of airgaps affects the size or form factor of the semiconductor device.

Are there any limitations to the use of airgaps in semiconductor devices?

The article does not discuss any potential drawbacks or limitations associated with the use of airgaps in semiconductor devices.

Original Abstract Submitted

One or more systems, devices and/or methods of use provided herein relate to an airgap spacer for power via. The semiconductor device can comprise a power bar wired to a backside power rail, wherein the power bar is located between a first gate of a first field effect transistor (FET) and a second gate of a second FET at least a first airgap between the power bar and at least a portion of the first gate of the first FET and a second airgap between the power bar and at least a portion of the second gate of the second FET, wherein the at least the first airgap and the second airgap maintain parasitic capacitance in the semiconductor device below a threshold.