18054187. METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Huai Huang of Clifton Park NY (US)

Hosadurga Shobha of Niskayuna NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Brent A. Anderson of Jericho VT (US)

METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18054187 titled 'METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING

Simplified Explanation

The microelectronic structure described in the patent application includes a first metal line, a second metal line, and a third metal line connected by a skip-via. The skip-via consists of a bottom section and a top section, with the bottom sidewall of the bottom section at a first angle and the top sidewall of the top section at a second angle opposite to the first angle.

• First metal line, second metal line, and third metal line in the microelectronic structure.
• Skip-via connecting the first metal line to the third metal line.
• Skip-via includes a bottom section and a top section with different sidewall angles.

Potential Applications

This technology could be applied in:

• Semiconductor manufacturing
• Integrated circuit design
• Microelectronics industry

Problems Solved

This technology helps in:

• Improving signal transmission
• Reducing power consumption
• Enhancing circuit performance

Benefits

The benefits of this technology include:

• Increased efficiency in electronic devices
• Enhanced reliability of connections
• Improved overall performance of microelectronic structures

Potential Commercial Applications

Optimizing microelectronic structures for:

• Consumer electronics
• Telecommunications equipment
• Automotive electronics

Possible Prior Art

Prior art may include:

• Existing skip-via designs in microelectronic structures
• Patents related to metal line connections in semiconductor devices

How does this technology compare to traditional skip-via designs?

This article does not provide a direct comparison between this technology and traditional skip-via designs. It would be helpful to understand the specific advantages or differences that this new design offers over existing methods.

What impact could this technology have on the cost of manufacturing microelectronic structures?

The article does not address the potential cost implications of implementing this technology. It would be valuable to explore how this innovation may affect the overall cost of manufacturing microelectronic structures and whether it could lead to cost savings in the long run.

Original Abstract Submitted

A microelectronic structure including a first metal line, a second metal line, and a third metal line. A skip-via connecting the first metal line to the third metal line, where the skip-via includes a bottom section and a top section. A bottom sidewall of the bottom section is at a first angle and a top sidewall of the top section are at a second angle, where the first angle and the second angle are opposite from each other.