System and Method for Aligning Bonding Pads with Bonding Locations using Moiré Patterns

Abstract: a system and method for holding a chip on a chip chuck. the chip has a set of interconnect contacts. the system and method includes positioning a first grating relative to the set of interconnect contacts. the system and method includes measuring a first moir� pattern of the first grating and the set of interconnect contacts. the system and method includes adjusting position of the chip chuck relative to a substrate chuck based on the first moir� pattern.

Inventor(s): Dwayne L. LaBrake, Niyaz Khusnatdinov

CPC Classification: H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected})

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