International business machines corporation (20240162192). STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT simplified abstract
Contents
- 1 STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
Organization Name
international business machines corporation
Inventor(s)
Arvind Kumar of Chappaqua NY (US)
Todd Edward Takken of Brewster NY (US)
John W Golz of HOPEWELL JCT NY (US)
Joshua M. Rubin of Albany NY (US)
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162192 titled 'STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
Simplified Explanation
The semiconductor module described in the abstract consists of two semiconductor dies stacked on top of each other. The first semiconductor die includes a power support structure and a cache region, while the second semiconductor die includes a logic core and a cache region. The logic core is electrically connected to the power support structure of the first die, and the second cache region is connected to the first cache region.
- The semiconductor module includes two stacked semiconductor dies.
- The first die has a power support structure and a cache region.
- The second die has a logic core and a cache region.
- The logic core is connected to the power support structure of the first die.
- The second cache region is connected to the first cache region.
Potential Applications
This technology could be applied in high-performance computing systems, data centers, and other applications requiring efficient processing and memory capabilities.
Problems Solved
This technology solves the problem of optimizing space and connectivity in semiconductor modules, allowing for improved performance and efficiency in electronic devices.
Benefits
The benefits of this technology include increased processing speed, reduced power consumption, and enhanced overall performance of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include server systems, networking equipment, and high-end consumer electronics.
Possible Prior Art
Prior art in semiconductor packaging and stacking technologies may exist, but specific examples are not provided in this context.
Unanswered Questions
How does this technology compare to traditional semiconductor packaging methods?
This article does not provide a direct comparison between this technology and traditional semiconductor packaging methods.
What are the potential challenges in implementing this technology on a larger scale?
The article does not address the potential challenges that may arise when scaling up the production and integration of this semiconductor module design.
Original Abstract Submitted
a semiconductor module includes a first semiconductor die, which comprises (i) a power support structure and (ii) a first cache region; and a second semiconductor die, which is mounted on top of the first semiconductor die and comprises (i) a logic core, which overlies and is electrically connected to the power support structure, and (ii) a second cache region, which overlies and is electrically connected to the first cache region.
