International business machines corporation (20240162139). METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING simplified abstract

METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING

Organization Name

international business machines corporation

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Huai Huang of Clifton Park NY (US)

Hosadurga Shobha of Niskayuna NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Brent A. Anderson of Jericho VT (US)

METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240162139 titled 'METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING

Simplified Explanation

The microelectronic structure described in the abstract includes a first metal line, a second metal line, and a third metal line connected by a skip-via. The skip-via consists of a bottom section and a top section, with the bottom sidewall at one angle and the top sidewall at the opposite angle.

• The skip-via connects three metal lines in a microelectronic structure.
• The skip-via has a unique design with bottom and top sections at different angles.

Potential Applications

This technology could be applied in:

• Integrated circuits
• Semiconductor devices
• Microelectronics

Problems Solved

This technology helps in:

• Improving signal transmission
• Reducing signal interference

Benefits

The benefits of this technology include:

• Enhanced performance of microelectronic devices
• Increased efficiency in signal routing

Potential Commercial Applications

The potential commercial applications of this technology could be in:

• Electronics manufacturing industry
• Semiconductor companies

Possible Prior Art

One possible prior art could be:

• Existing skip-via designs in microelectronic structures

Unanswered Questions

How does the angle of the sidewalls affect the performance of the skip-via?

The angle of the sidewalls could impact signal transmission and interference, but further research is needed to understand the exact implications.

Are there any limitations to the design of the skip-via in this microelectronic structure?

It is unclear if there are any limitations to the design that could affect the overall functionality of the microelectronic structure. Further testing and analysis may be required to determine any potential constraints.

Original Abstract Submitted

a microelectronic structure including a first metal line, a second metal line, and a third metal line. a skip-via connecting the first metal line to the third metal line, where the skip-via includes a bottom section and a top section. a bottom sidewall of the bottom section is at a first angle and a top sidewall of the top section are at a second angle, where the first angle and the second angle are opposite from each other.