Samsung electronics co., ltd. (20240164081). SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact the overall cost of manufacturing semiconductor devices?
- 1.11 What are the environmental implications of using penetration contacts in semiconductor devices?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
Organization Name
Inventor(s)
Shaofeng Ding of Suwon-si (KR)
Jeong Hoon Ahn of Seongnam-si (KR)
SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240164081 titled 'SEMICONDUCTOR DEVICE AND STACK OF SEMICONDUCTOR CHIPS
Simplified Explanation
The semiconductor device described in the patent application includes a substrate with a logic cell region and a connection region, a dummy transistor on the connection region, an intermediate connection layer with a connection pattern connected to the dummy transistor, a first metal layer, and an etch stop layer between the intermediate connection layer and the first metal layer. Additionally, there is a penetration contact extending from the first metal layer towards the bottom surface of the substrate, penetrating the connection region.
- Substrate with logic cell region and connection region
- Dummy transistor and intermediate connection layer
- First metal layer and etch stop layer
- Penetration contact towards the bottom surface of the substrate
Potential Applications
This technology could be applied in:
- Integrated circuits
- Semiconductor devices
- Electronic components
Problems Solved
This technology helps in:
- Improving connectivity in semiconductor devices
- Enhancing performance of logic cells
- Ensuring reliable electrical connections
Benefits
The benefits of this technology include:
- Increased efficiency in semiconductor devices
- Enhanced functionality of logic cells
- Improved overall performance of electronic components
Potential Commercial Applications
Potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications industry
- Automotive sector
Possible Prior Art
One possible prior art could be the use of etch stop layers in semiconductor devices to improve connectivity and performance.
Unanswered Questions
How does this technology impact the overall cost of manufacturing semiconductor devices?
The article does not address the potential cost implications of implementing this technology in semiconductor device manufacturing processes.
What are the environmental implications of using penetration contacts in semiconductor devices?
The article does not discuss the environmental impact of utilizing penetration contacts in semiconductor devices and whether they pose any risks to the environment.
Original Abstract Submitted
a semiconductor device includes a substrate including a logic cell region and a connection region, a dummy transistor on the connection region, an intermediate connection layer on the dummy transistor, the intermediate connection layer including a connection pattern electrically connected to the dummy transistor, a first metal layer on the intermediate connection layer, an etch stop layer between the intermediate connection layer and the first metal layer, the etch stop layer covering a top surface of the connection pattern, and a penetration contact extended from the first metal layer toward a bottom surface of the substrate penetrating the connection region.
