Samsung electronics co., ltd. (20240162188). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungryong Oh of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162188 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes multiple chip structures on a substrate, with an encapsulant covering them. The third chip structure is positioned between the first and second chip structures, with a lower chip structure overlapping a portion of the space between them, and an upper chip structure on top.
- The semiconductor package includes a substrate, first, second, and third chip structures, and an encapsulant.
- The third chip structure overlaps a portion of the space between the first and second chip structures.
- The upper chip structure is positioned on top of the lower chip structure in the third chip structure.
Potential Applications
This technology could be applied in:
- Advanced electronic devices
- Semiconductor manufacturing industry
Problems Solved
This technology helps in:
- Improving chip structure integration
- Enhancing overall performance of semiconductor packages
Benefits
The benefits of this technology include:
- Increased efficiency in semiconductor packaging
- Better thermal management
- Enhanced durability of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive industry
Possible Prior Art
One possible prior art could be:
- Traditional semiconductor packaging techniques
Unanswered Questions
How does this technology impact the overall cost of semiconductor packaging?
The cost implications of implementing this technology are not discussed in the abstract. It would be interesting to know if this innovation leads to cost savings or increased expenses.
What are the environmental implications of using this technology in semiconductor manufacturing?
The environmental impact of this technology, such as waste generation or energy consumption, is not addressed in the abstract. Understanding the sustainability aspects of this innovation would be valuable.
Original Abstract Submitted
a semiconductor package includes a substrate; a first chip structure on the substrate and having a first thickness in a first direction; a second chip structure on the substrate adjacent to the first chip structure along a second direction and having a second thickness in the first direction; a third chip structure on the substrate and adjacent to the first chip structure and the second chip structure in a third direction perpendicular to the second direction; and an encapsulant covering the first chip structure, the second chip structure, and the third chip structure, wherein the third chip structure includes a lower chip structure that overlaps a first portion of a space between the first chip structure and the second chip structure in the third direction, and an upper chip structure on the lower chip structure such that a second portion of the space is exposed in the third direction.
