Samsung electronics co., ltd. (20240162181). SEMICONDUCTOR PACKAGES simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Sun Kyoung Seo of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162181 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor chip extending in two intersecting directions, a second semiconductor chip on top of the first chip in a perpendicular direction, and a bump structure with a conductive material layer between the two chips. The bump structure consists of two bump structures of different thicknesses overlapping different areas of the second chip.
- First semiconductor chip extending in two intersecting directions
- Second semiconductor chip on top of the first chip in a perpendicular direction
- Bump structure with a conductive material layer between the two chips
- Two bump structures of different thicknesses overlapping different areas of the second chip
Potential Applications
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and efficient semiconductor packaging.
Problems Solved
This technology solves the problem of efficiently stacking multiple semiconductor chips in a compact package while ensuring proper electrical connections between them.
Benefits
The benefits of this technology include increased functionality in smaller electronic devices, improved performance due to efficient chip stacking, and potentially lower manufacturing costs.
Potential Commercial Applications
- "Compact Semiconductor Package Technology for Enhanced Electronic Devices"
Possible Prior Art
There may be prior art related to semiconductor packaging techniques involving bump structures and conductive material layers, but specific examples would need to be researched further.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison to existing semiconductor packaging methods, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.
What are the specific electronic devices that could benefit most from this technology?
The article does not specify which electronic devices would benefit the most from this technology, leaving room for speculation on its potential applications in different industries.
Original Abstract Submitted
a semiconductor package comprising: a first semiconductor chip extending in each of first and second directions that intersect each other; a second semiconductor chip on the first semiconductor chip in a third direction perpendicular to the first and second directions, wherein the second semiconductor chip includes a first area and a second area that is adjacent to and extends around the first area; and a bump structure and a conductive material layer between the first and second semiconductor chips, wherein the conductive material layer is on the bump structure, wherein the bump structure includes a first bump structure overlapping the first area in the third direction, and a second bump structure overlapping the second area in the third direction, wherein the first and second bump structures are spaced apart from each other, and a thickness of the second bump structure is larger than a thickness of the first bump structure.
