Samsung electronics co., ltd. (20240162104). SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD
Organization Name
Inventor(s)
Hyunchul Jung of Suwon-si (KR)
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162104 titled 'SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD
Simplified Explanation
The semiconductor device described in the abstract includes a substrate, front pads on the substrate, and a circuit layer with interconnections connected to the front pads. The circuit layer may be positioned between the front pads and the substrate, and may have a burr on its side surface that protrudes below the front surface of the circuit layer, forming a step portion.
- Substrate with front pads and circuit layer:
- The device consists of a substrate with front pads and a circuit layer. - The front pads are located on the front surface of the substrate. - The circuit layer includes an insulating layer and interconnections connected to the front pads.
- Burr on the side surface of the circuit layer:
- The side surface of the circuit layer may have a burr. - The burr protrudes below the front surface of the circuit layer. - The burr forms a step portion in the circuit layer.
Potential Applications
The technology described in this patent application could be applied in the semiconductor industry for the development of advanced semiconductor devices with improved circuit layer design.
Problems Solved
This technology addresses the issue of optimizing the layout and structure of semiconductor devices to enhance performance and functionality.
Benefits
The benefits of this technology include improved electrical connectivity, enhanced circuit design, and potentially increased efficiency in semiconductor device operation.
Potential Commercial Applications
The technology could have commercial applications in the manufacturing of various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.
Possible Prior Art
One possible prior art could be the use of circuit layers with interconnections in semiconductor devices, but the specific design features related to the burr and step portion may be novel.
Unanswered Questions
How does the presence of the burr on the circuit layer impact the overall performance of the semiconductor device?
The article does not provide specific details on how the burr on the circuit layer affects the functionality or efficiency of the semiconductor device.
Are there any potential challenges or limitations associated with the implementation of this technology in semiconductor manufacturing processes?
The article does not address any potential obstacles or constraints that may arise when integrating this technology into existing semiconductor manufacturing practices.
Original Abstract Submitted
a semiconductor device may include a substrate, one or more front pads disposed on a front surface of the substrate, and a circuit layer including an insulating layer and at least one interconnection electrically connected to the one or more front pads. in some embodiments, the circuit layer may be disposed between the one or more front pads and the substrate. in some embodiments, a side surface of the circuit layer may include a burr that protrudes a height that is below a level of a front surface of the circuit layer. additionally or alternatively, the burr may form a step portion in the circuit layer.
