Samsung electronics co., ltd. (20240157481). SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240157481 titled 'SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME
Simplified Explanation
The semiconductor chip splitting method using a laser involves forming wiring on the front surface of a semiconductor substrate, creating a lower trench at the rear surface, scribing a laser line on the substrate, and then splitting the substrate along the scribing line.
- Back-end-of-line (BEOL) process involves forming wiring on or above the front surface of the semiconductor substrate.
- A lower trench is formed at the rear surface of the semiconductor substrate.
- A laser scribing line is created on the semiconductor substrate overlapping the lower trench.
- The semiconductor substrate is split into chips by cutting along the laser scribing line.
Potential Applications
This technology can be applied in semiconductor manufacturing processes for efficient chip splitting and packaging.
Problems Solved
This method solves the challenge of accurately and cleanly splitting semiconductor substrates into individual chips.
Benefits
The use of a laser for chip splitting offers precision and control, resulting in higher yields and reduced material waste.
Potential Commercial Applications
"Semiconductor Chip Splitting Method Using a Laser" - Improving semiconductor manufacturing processes.
Possible Prior Art
Prior art may include methods of semiconductor chip singulation using mechanical scribing or cleaving techniques.
Unanswered Questions
How does this method compare to traditional mechanical chip splitting techniques?
The article does not provide a direct comparison between laser-based chip splitting and traditional methods such as scribing or cleaving.
Are there any limitations or challenges associated with using a laser for chip splitting?
The article does not address any potential limitations or challenges that may arise when implementing this technology in semiconductor manufacturing processes.
Original Abstract Submitted
a semiconductor chip splitting method using a laser includes: performing a back-end-of-line (beol) process comprising forming wiring at or above a front surface of a semiconductor substrate; forming a lower trench at a rear surface of the semiconductor substrate; forming a laser scribing line on the semiconductor substrate along a region overlapping the lower trench; and splitting the semiconductor substrate into chips by a process comprising cutting along the laser scribing line.
